Patents by Inventor Huan-Hsiang Huang

Huan-Hsiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060185827
    Abstract: A heat pipe cooling system comprising an evaporator, a pipeline, a working fluid and a thermal connector is provided. The evaporator is connected to a heat-generating element, and the pipeline is connected to the evaporator. The working fluid is injected into a closed loop formed by the evaporator and the pipeline. The thermal connector comprises a first thermal conductive block and a second thermal conductive block. The first thermal conductive block has many first fitting parts and a contact surface. The contact surface is suitable for attaching to one of the surfaces of an object. The second thermal conductive block has many second fitting parts. The second fitting parts are suitable for meshing with the first fitting parts to form a piping channel inside the thermal connector. The piping channel is suitable for enclosing a section of the pipeline or directly serving as a part of the pipeline.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 24, 2006
    Inventors: Bin-Juine Huang, Chih-Hung Wang, Huan-Hsiang Huang, Yu-Yuan Yeh
  • Publication number: 20050082033
    Abstract: The heat transfer device at least comprises: an evaporator, a heat conductor and a connecting pipe.. The evaporator comprises: a first hollow tube; a porous core mortised inside the first hollow tube; and a second hollow tube mortised on the first hollow tube. The heat conductor 220 covers the evaporator. The heat conductor is on the heating device. The connecting pipe is connected to first and second hollow tubes. The connecting pipe is used for containing a working fluid. The condenser is on the connecting pipe. The porous core, the first and second hollow tube, and the heat conductor are mortised together so as to simplify the manufacturing process, and reduce the cost. Further, the evaporator is tightly covered and fixed by the heat conductor so that the heat generated by the heating device can be uniformly conducted to the evaporator to enhance the heat conductivity.
    Type: Application
    Filed: July 27, 2004
    Publication date: April 21, 2005
    Inventors: Bin-Juine Huang, Chern-Shi Lam, Chih-Hung Wang, Huan- Hsiang Huang, Yu-Yuan Yen