Patents by Inventor Huan-Hsin Yeh

Huan-Hsin Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus equipped with substrate scanner
    Patent number: 11551955
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH SUBSTRATE SCANNER
    Publication number: 20210280444
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Application
    Filed: March 26, 2020
    Publication date: September 9, 2021
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • SEMICONDUCTOR PROCESS
    Publication number: 20130045603
    Abstract: A semiconductor process is described as follows. A material layer is provided on a substrate. A low-temperature oxidation treatment is performed to the material layer. A photoresist layer is formed on the material layer after the low-temperature oxidation treatment. The photoresist layer is patterned.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 21, 2013
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chao-Yu Tsai, Chih-Chung Huang, Tsz-Yuan Chen, Kung-Hsun Tsao, Huan-Hsin Yeh, Yu-Huan Liu
  • Process for forming anti-reflection coating and method for improving accuracy of overlay measurement and alignment
    Patent number: 7524595
    Abstract: A method for forming an anti-reflection coating (ARC) with no hole over an overlay mark is described, which applies a fluid material of the ARC onto a substrate and then conducts at least two curing steps to convert the fluid material into the ARC. Such a bottom anti-reflection coating with no hole over the overlay mark can improve accuracy of the overlay measurement of lithography, thereby improving the alignment accuracy of the lithography process.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: April 28, 2009
    Assignee: United Microelectronics Corp.
    Inventors: Wen-Kuang Lin, Huan-Hsin Yeh, Chung-An Chen
  • Process for forming anti-reflection coating and method for improving accuracy of overlay measurement and alignment
    Publication number: 20070054205
    Abstract: A method for forming an anti-reflection coating (ARC) with no hole over an overlay mark is described, which applies a fluid material of the ARC onto a substrate and then conducts at least two curing steps to convert the fluid material into the ARC. Such a bottom anti-reflection coating with no hole over the overlay mark can improve accuracy of the overlay measurement of lithography, thereby improving the alignment accuracy of the lithography process.
    Type: Application
    Filed: September 8, 2005
    Publication date: March 8, 2007
    Inventors: Wen-Kuang Lin, Huan-Hsin Yeh, Chung-An Chen