Patents by Inventor Huan-Jung Lee

Huan-Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11416047
    Abstract: A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: August 16, 2022
    Assignees: Micro-Star International Co., Ltd., MSI Computer (Shenzhen) Co., Ltd
    Inventors: Yu An Wang, Chun Mo Wu, Chih-Shiang Hsu, Wei En Kao, Shuan-Cheng Su, Kung Ming Shen, Chia Chun Lin, Chung-Bi Lee, Huan-Jung Lee, Cheng-Lung Chen, Chia Hao Yeh
  • Patent number: D661330
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: June 5, 2012
    Assignee: Ability Enterprise Co., Ltd.
    Inventors: Chia-Ming Yu, Huan-Jung Lee