Patents by Inventor Huan-Kai Chou

Huan-Kai Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of attaching heat sinks to a circuit tape
    Patent number: 11350518
    Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Chipbond Technology Corporation
    Inventors: Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen, Wen-Fu Chou
  • METHOD AND DEVICE OF HEAT SINK ATTACHMENT TO A CIRCUIT TAPE
    Publication number: 20210227679
    Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.
    Type: Application
    Filed: July 13, 2020
    Publication date: July 22, 2021
    Inventors: Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen, Wen-Fu Chou