Patents by Inventor Huan-Lisng Tzeng

Huan-Lisng Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210202295
    Abstract: In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.
    Type: Application
    Filed: March 11, 2021
    Publication date: July 1, 2021
    Inventors: Huan-Lisng Tzeng, Chen-Chun Yan, Yao-Pin Yang
  • Patent number: 10950483
    Abstract: In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: March 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huan-Lisng Tzeng, Chen-Chun Yan, Yao-Pin Yang
  • Publication number: 20190164804
    Abstract: In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.
    Type: Application
    Filed: November 19, 2018
    Publication date: May 30, 2019
    Inventors: Huan-Lisng TZENG, Chen-Chun Yan, Yao-Pin Yang
  • Patent number: 10155305
    Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: December 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huan-Lisng Tzeng, Chia-Chi Chung, Kuo-Yen Chang
  • Publication number: 20170282347
    Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Huan-Lisng Tzeng, Chia-Chi Chung, Kuo-Yen Chang