Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element stacking structure is disposed on a carrier structure to integrate multiple chips into a single package, so that the electronic package can meet with the requirements of miniaturization without increasing the layout area of the carrier structure.

Abstract: An electronic package and the manufacturing method thereof are provided, in which a first electronic element and a second electronic element are disposed on a carrier structure, and the first electronic element and the second electronic element are electrically connected to each other by a wire. Therefore, by replacing some layers of the circuit layer of the carrier structure with the wire, the carrier structure can satisfy the functional signal transmission of the first and second electronic elements without configuring too many circuit layers, so as to shorten the process steps and time of the carrier structure, thereby effectively reducing the manufacturing cost of the electronic package.

Abstract: A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat portions and contacting portions, providing at least a circuit board having a plurality of electrical connection pads, mounting the contacting portions on and electrically connecting to the electrical connection pads, attaching and electrically connecting electronic elements to the circuit board, forming an encapsulant for encapsulating the lead frames and the electronic elements but uncovering the flat portions of the terminal leads, and cutting around the circuit board along a cutting path that crosses through each of the terminal leads so as to allow each of the terminal leads to be electrically independent, wherein the terminal leads are employed to act as the electrical terminals of USB memory cards for storing or retrieving data.

Abstract: A circuit card module and a method for fabricating the same are disclosed. The present invention includes the steps of providing a carrier having at least a first carrying region and a second carrying region that are co-planar; respectively mounting a substrate electrically connected to a first chip on the first carrying region, and a second chip electrically connected the substrate on the second carrying region, wherein the substrate is provided with at least an area of electrical connecting portion for being connected with external devices so as to reduce areas required for mounting a larger substrate or another substrate, thereby allowing a circuit card module to be fabricated with a minimized substrate.