Patents by Inventor Huan-Shu CHIEN

Huan-Shu CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240196565
    Abstract: A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.
    Type: Application
    Filed: March 29, 2023
    Publication date: June 13, 2024
    Inventors: Chao-Jung CHEN, Kuo-Wei LEE, Huan-Shu CHIEN
  • Patent number: 11692643
    Abstract: A connector assembly includes a first and a second component. Each of the components including a connector body, a valve, a handle, a handle lock, and a connector lock. The handles open and close respective valves. Each of the handles has locked and unlocked positions. The handle locks prevent or inhibit the respective handles from being moved between open and closed positions. The handle locks in unlocked positions enable the respective handles to be moved between open and closed positions. The first and second components are configured to be releasably assembled with each other. The connector locks in their respective closed positions assist in preventing or inhibiting the disassembling of the first and second components.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: July 4, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Huan-Shu Chien
  • Patent number: 11683910
    Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: June 20, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Huan-Shu Chien
  • Publication number: 20220346271
    Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.
    Type: Application
    Filed: August 10, 2021
    Publication date: October 27, 2022
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Huan-Shu CHIEN