Patents by Inventor Huan-Ting Tseng

Huan-Ting Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8461005
    Abstract: A method of manufacturing doping patterns includes providing a substrate having a plurality of STIs defining and electrically isolating a plurality of active regions in the substrate, forming a patterned photoresist having a plurality of exposing regions for exposing the active regions and the STIs in between the active regions on the substrate, and performing an ion implantation to form a plurality of doping patterns in the active regions.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: June 11, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Huan-Ting Tseng, Chun-Hsien Huang, Hung-Chin Huang, Chen-Wei Lee
  • Publication number: 20110217821
    Abstract: A method of manufacturing doping patterns includes providing a substrate having a plurality of STIs defining and electrically isolating a plurality of active regions in the substrate, forming a patterned photoresist having a plurality of exposing regions for exposing the active regions and the STIs in between the active regions on the substrate, and performing an ion implantation to form a plurality of doping patterns in the active regions.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 8, 2011
    Inventors: Huan-Ting Tseng, Chun-Hsien Huang, Hung-Chin Huang, Chen-Wei Lee
  • Patent number: 7633601
    Abstract: To avoid the yield of wafers that undergo immersion lithography influencing by delay of post exposure baking (PEB), an operation system adjusts a speed of inputting the wafers to undergo immersion lithography according to a status of wafers that have finished exposure and are waiting for baking. Therefore, the wafers that have finished exposure are transmitted to be baked efficiently and on time.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: December 15, 2009
    Assignee: United Microelectronics Corp.
    Inventors: Yong-Fa Huang, Benjamin Szu-Min Lin, Chun-Chi Yu, Huan-Ting Tseng, Bo-Jou Lu
  • Publication number: 20080067335
    Abstract: A method of moving bubbles includes utilizing optical tweezers to form a bright photoresist area and a dark photoresist area in the photoresist layer. The bubbles in the photoresist layer move from the bright photoresist area to the dark photoresist area.
    Type: Application
    Filed: July 17, 2006
    Publication date: March 20, 2008
    Inventors: Ya-Ching Hou, Huan-Ting Tseng, Benjamin Szu-Min Lin, Bo-Jou Lu, Yong-Fa Huang, Chun-Chi Yu
  • Publication number: 20070215040
    Abstract: To avoid the yield of wafers that undergo immersion lithography influencing by delay of post exposure baking (PEB), an operation system adjusts a speed of inputting the wafers to undergo immersion lithography according to a status of wafers that have finished exposure and are waiting for baking. Therefore, the wafers that have finished exposure are transmitted to be baked efficiently and on time.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Inventors: Yong-Fa Huang, Benjamin Szu-Min Lin, Chun-Chi Yu, Huan-Ting Tseng, Bo-Jou Lu