Patents by Inventor Huan Tu

Huan Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979980
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: May 7, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20190165411
    Abstract: This invention revolves around a new porous-electrode lithium-ion battery, including a cap, an anode tab, a winder, a cathode tab, and a battery core shell. The anode and cathode tabs are located at the upper and lower parts of the winder, respectively, and the battery core shell at the outermost part of the battery. A cap is designed at the top of the winder equipped with anode and cathode, between which there is separation paper. The anode has a front coating as well as a back coating. This invention punches numerous pores in the anode or cathode and then fills the pores with anode or cathode materials. From the perspective of physics, this can increase the volume of anode or cathode materials to maximize the room for electrons and then improve battery capacity. The invention which can heighten battery capacity in unit volume raises the range of the energy vehicles by 25% or reduces the weight of vehicle body.
    Type: Application
    Filed: November 29, 2017
    Publication date: May 30, 2019
    Inventors: Huan Tu, Chang-Yong Yang
  • Patent number: 9656867
    Abstract: This present invention relates to a method of synthesizing copper selenide powder by using a hot-injection method wherein a proper amount of a reducing agent is added to a mixed solution made of copper cationic solution and selenium anionic solution, and the mixed solution is maintained at a temperature of 230° C. for 40 minutes to obtain Copper Selenide powder. The Copper selenide powder, which is in the form of CuSe or Cu2-xSe, can be synthesized by adjusting the amount of the reducing agent being added to the mixed solution.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: May 23, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Hsing-I Hsiang, Chang-Ting Yang, Jui-Huan Tu, Juu-En Chang
  • Publication number: 20160257567
    Abstract: This present invention relates to a method of synthesizing copper selenide powder chemical by using a hot-injection method wherein a proper amount of a. reducing agent is added to a mixed solution made of copper cationic solution and selenium anionic solution, and the mixed solution is maintained at a temperature of 230° C. for 40 minutes to obtain Copper Selenide powder. The Copper selenide powder which is in the form of CuSe or Cu2-xSe, can be synthesized by adjusting the amount of the reducing agent being added to the mixed solution.
    Type: Application
    Filed: March 5, 2015
    Publication date: September 8, 2016
    Applicant: National Cheng Kung University
    Inventors: Hsing-I Hsiang, Chang-Ting Yang, Jui-Huan Tu, Juu-En Chang
  • Publication number: 20040109753
    Abstract: A cross flow fan mainly includes an enclosure, a cross fan and a motor. When the cross fan rotates by the motor, air is drawn into the cross flow fan through the intake hole and then is exhausted through the ventilating hole. The device is characterized in that the ventilating hole and the intake hole is located on the position of 0 degree and 180 degrees respectively and the end point of the arched wind fending board is located on the range from 70 to 150 degrees. The wind fending board installed between the intake hole and the ventilating hole is arched in an radian a bit larger than that of the fringe of the cross fan so as to have better ventilating efficiency.
    Type: Application
    Filed: December 10, 2002
    Publication date: June 10, 2004
    Inventors: Huan-Tu Lin, Chang-Cheng Chen, Wen-Guang Sheu, Hsiao-Peng Liu