Abstract: An electronic device, comprising: a housing; working assemblies mounted in the housing, wherein each working assembly comprises a circuit board and a radiator, the circuit board comprising a substrate and a plurality of working chips provided on the substrate; and the working assemblies are detachably mounted within the housing; a control board connected to the circuit board; and a power source configured to supply power to the circuit board.

Abstract: The present teaching relates to different configurations for facilitating calibration of multiple sensors of different types. A plurality of fiducial markers are arranged in space for simultaneously calibrating multiple sensors of different types. Each of the plurality of fiducial markers has a feature point thereon and is provided to enable the multiple sensors to calibrate by detecting the features points and estimating their corresponding 3D coordinates with respect to respective coordinate systems of the multiple sensors.

Abstract: This application provides a magneto-resistive random access memory, to reduce a chip area. The magneto-resistive random access memory includes: a plurality of stacked stacking layers, where each stacking layer includes a plurality of magnetic memory cells arranged in a two-dimensional manner; and a plurality of selective metal layers, where each stacking layer is disposed between two selective metal layers and is adjacent to the two selective metal layers, and each selective metal layer is connected to a magnetic memory cell in an adjacent stacking layer, and is configured to perform a read/write operation on the magnetic memory cell.

Abstract: An array substrate and a manufacturing method therefor, and a display panel are provided. The manufacturing method includes: forming a scan line and a gate on a substrate; forming a first insulating layer covering the scan line and the gate on the substrate; forming a metal oxide semiconductor layer above the first insulating layer, the metal oxide semiconductor layer including a source, a drain and an active layer; coating an upper surface of the metal oxide semiconductor layer with a photosensitive material layer; photoetching the photosensitive material layer from the back side of the substrate by using a first metal layer as a mask to form a channel protection layer; performing conductorization treatment on the metal oxide semiconductor layer to enable the source and the drain to be conductive; forming a data line above the first insulating layer; and forming a pixel electrode above the first insulating layer.

Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: A touch display device includes a driving substrate, a display medium layer, a conductive film, a touch panel, a circuit board, a reinforcing structure layer and a light guide plate. The driving substrate includes a first portion, a second portion and a bending portion connecting the first portion and the second portion. The display medium layer is disposed on the first portion. The conductive film is disposed on the first portion and located on the display medium layer. The touch panel is disposed on the first portion and located on the conductive film. The circuit board is disposed on the second portion. The reinforcing structure layer is disposed on the bending portion and extends to the first portion to seal the space. The light guide plate is disposed on the first portion.

Abstract: A shapable display device includes a first deformable substrate, a first stretchable electrode layer, a stretchable display medium layer, and a second stretchable electrode layer. The first stretchable electrode layer is disposed on the first deformable substrate. The stretchable display medium layer is disposed on the first stretchable electrode layer. The second stretchable electrode layer is disposed on the stretchable display medium layer. The stretchable display medium layer is between the first stretchable electrode layer and the second stretchable electrode layer.

Abstract: An array substrate includes a substrate, a gate line, multiple active elements, a protective layer, a pixel electrode, and an extension electrode. The substrate has an active area and a peripheral area. The gate line and the active elements are disposed in the active area of the substrate. The protective layer is disposed on the substrate and covers the gate lines and the active elements. The protective layer has multiple openings-exposing a portion of the gate line and a portion of the active elements. The pixel electrode is extended to and disposed in the openings of the protective layer to electrically connect to the gate line and the active elements. The extension electrode is disposed in the peripheral area and located on the protective layer. A portion of the extension electrode is extended to and overlapped with the pixel electrode and is electrically connected to the pixel electrode.

Abstract: A touch display device includes a driving substrate, a display medium layer, a conductive film, a touch panel, a circuit board and a reinforcing structure layer. The driving substrate includes a first portion, a second portion and a bending portion connecting the first portion and the second portion. The display medium layer is disposed on the first portion of the driving structure. The conductive film is disposed on the first portion of the driving structure and located on the display medium layer. The touch panel is disposed on the first portion of the driving substrate and located on the conductive film. The circuit board is disposed on the second portion of the driving substrate. The reinforcing structure layer is disposed on the bending portion of the driving substrate and extends to the first portion to seal the space.

Abstract: An electronic paper display device includes a frame, a flexible substrate, a front panel, and a chip. The flexible substrate includes a first area, a second area, a bending area adjoining the first area and the second area, and a conductive glue disposing area. The first area and the conductive glue disposing area are located on the top surface of the frame. The flexible substrate has an L-shaped groove. When the bending area is bent through the L-shaped groove, the second area extends to the bottom surface of the frame. The front panel is located on the first area of the flexible substrate and has a conductive glue located in a non-display area. The conductive glue is located on the conductive glue disposing area of the flexible substrate. The chip is connected to the second area of the flexible substrate.

Abstract: An electronic paper display device includes a frame, an upper protective layer, a lower protective layer, a flexible substrate, a reinforcing layer, and a front panel. The upper protective layer and the lower protective layer are respectively located on a top surface and a bottom surface of the frame. The flexible substrate extends from the upper protective layer to the lower protective layer. The flexible substrate has a first area located on the upper protective layer, a second area located on the lower protective layer, a bending area, and two non-deformed areas. One of the two non-deformed areas is located between the first area and the bending area, and another one of the two non-deformed areas is located between the second area and the bending area. The reinforcing layer is located on the flexible substrate. The front panel is located on the first area.

Abstract: A display device includes a driving substrate, a display medium layer, a protection assembly, a sealant layer, a driving chip, and a conductive substance. The driving substrate has a display area, a sealed area, and a peripheral area. The display medium layer is disposed in the display area of the driving substrate. The protection assembly is located on the display medium layer and includes a cover plate and a transparent conductive layer disposed on the cover plate. The sealant layer is disposed in the sealed area of the driving substrate to as least cover a periphery of the display medium layer. The driving chip is disposed in the peripheral area of the driving substrate. The conductive substance is disposed on the transparent conductive layer of the protection assembly.

Abstract: A display device includes a driving substrate, a display medium layer, a conductive material, a protection assembly and a conductive terminal. The driving substrate includes a first portion, a second portion and a bent portion connecting the first portion and the second portion. The display medium layer is disposed on the first portion of the driving substrate. The conductive material is disposed on the second portion of the driving substrate. The protection assembly is disposed on the first portion of the driving substrate and located on the display medium layer. The protection assembly includes a film and a transparent conductive layer. The transparent conductive layer is disposed on the film and faces the display medium layer. The conductive terminal is connected to the protection assembly, and electrically connected to the transparent conductive layer and the conductive material.

Abstract: An array substrate and a manufacturing method therefor, and a display panel are provided. The manufacturing method includes: forming a scan line and a gate on a substrate; forming a first insulating layer covering the scan line and the gate on the substrate; forming a metal oxide semiconductor layer above the first insulating layer, the metal oxide semiconductor layer including a source, a drain and an active layer; coating an upper surface of the metal oxide semiconductor layer with a photosensitive material layer; photoetching the photosensitive material layer from the back side of the substrate by using a first metal layer as a mask to form a channel protection layer; performing conductorization treatment on the metal oxide semiconductor layer to enable the source and the drain to be conductive; forming a data line above the first insulating layer; and forming a pixel electrode above the first insulating layer.

Abstract: A display device includes a driving substrate, a display medium layer and a material layer. The display medium layer is disposed on the driving substrate. The material layer is disposed on a side of the display medium layer, and extends to the driving substrate. The material layer is a material layer with conductivity properties.

Abstract: An electronic paper display device includes a thin film transistor (TFT) array substrate, a light-transmitting substrate, a top electrode layer, a display medium layer, and a barrier layer. The top surface of the TFT array substrate has a bottom electrode layer. The light-transmitting substrate is located above the TFT array substrate. The top electrode layer is located on the bottom surface of the light-transmitting substrate. The display medium layer is located between the top electrode layer and the bottom electrode layer. The barrier layer is directly formed on at least one of the top surface and the bottom surface of the light-transmitting substrate. The barrier layer is in direct contact with the light-transmitting substrate, and is configured to resist moisture.

Abstract: A method for a direct current (DC) islanding detection based on positive feedback of a bus voltage at a specific frequency, essentially including three steps: extraction of a specific frequency component of the bus voltage, injection of a disturbance component of the specific frequency, and determination of DC islanding. The extraction of the specific frequency component of the bus voltage and the injection of the disturbance component of the specific frequency constitute a positive feedback mechanism in a power management unit control loop. In a grid-connected mode of a DC grid, the positive feedback mechanism fails due to a control action of a voltage management unit on a bus, and the bus voltage remains stable. In an islanding mode of the DC grid, under an action of the positive feedback mechanism, the power management unit allows the bus voltage to generate a self-excited oscillation at the specific frequency.

Abstract: Provided is a method of recycling an additively manufactured object into a reusable thermoplastic polymer, which method in some embodiments may include: (a) providing at least one additively manufactured object produced by stereolithography from a dual cure resin, the object comprising (i) a light polymerized polymer, and (ii) a heat polymerized polymer intermixed with said light polymerized polymer; (b) comminuting the object to produce a particulate material therefrom; (c) contacting the particulate material to a polar, aprotic solvent for a time and at a temperature sufficient to extract the heat polymerized polymer from the particulate material into said solvent, leaving residual particulate material comprising said light polymerized polymer in solid form; (d) separating the residual particulate material from said solvent; and then (e) separating the heat polymerized polymer from said solvent to provide a reusable thermoplastic polymer material in solid form.