Abstract: A heat dissipation device which is effectively vibration-free in relation to its host includes a fan, an enclosure, and a mounting apparatus. The mounting apparatus includes a receiving bracket for receiving the fan, a locking member, and a vibration-absorbing member slidably mounted to the enclosure. The receiving bracket has a locating member corresponding to the locating slot. The locating member is locked, and the vibration absorbing member abuts against a side of the receiving bracket, receiving and not transmitting the vibrations of a cooling fan.

Abstract: A heat dissipation device which is effectively vibration-free in relation to its host includes a fan, an enclosure, and a mounting apparatus. The mounting apparatus includes a receiving bracket for receiving the fan, a locking member, and a vibration-absorbing member slidably mounted to the enclosure. The receiving bracket has a locating member corresponding to the locating slot. The locating member is locked, and the vibration absorbing member abuts against a side of the receiving bracket, receiving and not transmitting the vibrations of a cooling fan.

Abstract: A system for cooling an electronic device applying the Peltier effect includes case, flow guiding device, heat dissipation module, and electronic component needing cooling in specific regions. The case has air inlet and heat outlet enclosing an internal space. The internal space includes cooling and heat exhausting regions. The flow guiding device is disposed around the air inlet to guide cooling medium into the internal space. The heat dissipation module includes a cooling device with hot and cold sides, the heat being exchanged from cold side to hot side. The cold side is coupled to the cooling region, the hot side to the heat exhausting region. The electronic component is coupled to the cooling region. The cooling medium flowing through the cooling region is cooled by the cold side and decreases the overall temperature of the electronic component or specific regions thereof.