Patents by Inventor Huang Chao

Huang Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088149
    Abstract: A semiconductor structure includes: a substrate; a first fin and a second fin disposed on the substrate and spaced apart from each other; a dielectric wall disposed on the substrate and having first and second wall surfaces; a third fin disposed on the substrate to be in direct contact with at least one of the first and second fins; a first device disposed on the first fin and including first channel features extending away from the first wall surface; a second device disposed on the second fin and including second channel features extending away from the second wall surface; at least one third device disposed on the third fin and including third channel features; and an isolation feature disposed on the substrate to permit the third device to be electrically isolated from the first and second devices. A method for manufacturing the semiconductor structure is also disclosed.
    Type: Application
    Filed: February 15, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ta-Chun LIN, Ming-Heng TSAI, Huang-Chao CHANG, Chun-Sheng LIANG, Chih-Hao CHANG, Jhon Jhy LIAW
  • Publication number: 20240079013
    Abstract: A method for evaluating a verification model includes receiving a first and a second set of verification results where each verification result indicates whether a primary model or an alternative model verifies an identity of a user as a registered user. The method further includes identifying each verification result in the first and second sets that includes a performance metric. The method also includes determining a first score of the primary model based on a number of the verification results identified in the first set that includes the performance metric and determining a second score of the alternative model based on a number of the verification results identified in the second set that includes the performance metric. The method further includes determining whether a verification capability of the alternative model is better than a verification capability of the primary model based on the first score and the second score.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: Google LLC
    Inventors: Jason Pelecanos, Pu-sen Chao, Yiling Huang, Quan Wang
  • Patent number: 11916200
    Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: February 27, 2024
    Inventors: David Cao, Cheng-Chieh Chao, Zhebo Chen, Lei Cheng, Niall Donnelly, Wes Hermann, Tim Holme, Tommy Huang, Kian Kerman, Yang Li, Harsh Maheshwari
  • Publication number: 20230335644
    Abstract: An exemplary method includes receiving a hybrid fin device layout for a hybrid fin device that includes a gate disposed over a single-fin active region and a multi-fin active region. The single-fin active region and the multi-fin active region extend lengthwise along a first direction. The gate extends lengthwise along a second direction, the second direction is different than the first direction, and the gate has a width along the first direction. The single-fin active region and a first portion of the gate form a first fin-based device having a first electrical characteristic. The multi-fin active region and a second portion of the gate form a second fin-based device having a second electrical characteristic that is different than the first electrical characteristic. The method further includes tuning the width of the gate to reduce a difference between the first electrical characteristic and the second electrical characteristic.
    Type: Application
    Filed: July 28, 2022
    Publication date: October 19, 2023
    Inventors: Yi-Juei Lee, Cheng-Tang Li, Huang-Chao Chang, Bi-Fen Wu
  • Publication number: 20220160311
    Abstract: An approach for determining a heart rate of a subject is performed by at least one processor and includes obtaining video data of the subject; detecting a face of the subject in the video data; selecting at least one region of interest (ROI) included in the face; acquiring photoplethysmography (PPG) signals based on the at least one ROI; and determining the heart rate of the subject based on the PPG signals
    Type: Application
    Filed: November 24, 2020
    Publication date: May 26, 2022
    Applicant: TENCENT AMERICA LLC
    Inventors: Huang CHAO, Lianyi HAN, Hui TANG, Shih-Yao LIN, Zhimin HUO, Wei FAN
  • Patent number: 11056392
    Abstract: A method for forming a FinFET device is described. The method includes the following steps. A substrate is patterned to form fins. Dummy gate stack is formed on the substrate and over the fins, wherein the dummy gate stack may be formed by the following steps: a dummy layer is formed; a first etching step is performed on the dummy layer with a bromine containing etching gas to form a dummy strip; a second etching step is performed on the dummy strip with a chlorine containing etching gas to form the dummy gate stack. The dummy gate stack is replaced with a gate stack.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chien Li, Wei-Shuo Ho, Huang-Chao Chang, Wei-Zhe Jhang
  • Patent number: 10989613
    Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: April 27, 2021
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Huang-Chao Chan
  • Patent number: 10836620
    Abstract: A handle and tiller head plug-in module for a material handling vehicle. The handle having an elongated tiller having an upper portion including at least one steering handgrip member and an upward extending wall surrounding electrical contacts associated with operator control functions. The tiller head plug-in module includes a housing having a downward extending wall surrounding electrical contacts, with the housing supporting a plurality of operator control interface elements, including at least one lift control element, and at least drive control element. The tiller head plug-in module is configured to be removably electrically connected to the handle when the upward extending wall surrounding the electrical contacts of the upper portion of the tiller is plugged into and received by the downward extending wall surrounding the electrical contacts of the housing.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 17, 2020
    Assignee: ZHEJIANG E-P EQUIPMENT CO., LTD.
    Inventors: Yu Jiandong, Lin Zuqian, Xu Minghui, Huang Chao, Ma Qichen
  • Publication number: 20200331733
    Abstract: A handle and tiller head plug-in module for a material handling vehicle. The handle having an elongated tiller having an upper portion including at least one steering handgrip member and an upward extending wall surrounding electrical contacts associated with operator control functions. The tiller head plug-in module includes a housing having a downward extending wall surrounding electrical contacts, with the housing supporting a plurality of operator control interface elements, including at least one lift control element, and at least drive control element. The tiller head plug-in module is configured to be removably electrically connected to the handle when the upward extending wall surrounding the electrical contacts of the upper portion of the tiller is plugged into and received by the downward extending wall surrounding the electrical contacts of the housing.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 22, 2020
    Inventors: Yu Jiandong, Lin Zuqian, Xu Minghui, Huang Chao, Ma Qichen
  • Patent number: 10787351
    Abstract: A pallet truck includes a front frame having at least one fork and being connected to a drive unit through a lift cylinder, a plug-in battery assembly, a hydraulic supply system and a plug-in controller assembly connected to the front frame, and an operator handle connected to the drive unit. The pallet truck may include a rear frame having caster wheel assemblies that are mounted from above, and where the rear frame is connected to the drive unit.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: September 29, 2020
    Assignee: ZHEJIANG E-P EQUIPMENT CO., LTD.
    Inventors: Wu Lili, Huang Chao, Ma Qichen, Dai Jincai, Xu Nengzi
  • Patent number: 10730728
    Abstract: A vehicle body and controller plug-in module for a material handling vehicle. The vehicle body having an upstanding body portion having an upwardly open compartment having a bottom including an upward extending wall surrounding electrical contacts associated with controller functions of the vehicle. The controller plug-in module includes a housing configured to be received by the upwardly open compartment of the vehicle body. The housing has a lower portion that includes an upward extending wall defining a recess surrounding electrical contacts. The controller plug-in module is configured to be removably electrically connected to the vehicle when the upward extending wall surrounding the electrical contacts of the upwardly open compartment of the upstanding body is plugged into and received by the recess in the lower portion of the housing of the controller plug-in module having the upward extending wall surrounding the electrical contacts of the controller plug-in module.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: August 4, 2020
    Assignee: ZHEJIANG E-P EQUIPMENT CO., LTD.
    Inventors: Ma Qichen, Huang Chao, Weng Lijian, Yu Jiandong
  • Publication number: 20190376853
    Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a priority of first finger circuits of the first sensing circuit and a priority of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.
    Type: Application
    Filed: May 17, 2019
    Publication date: December 12, 2019
    Inventors: TZU-HSUAN HUANG, WEI-LIANG LIU, HUANG-CHAO CHAN
  • Publication number: 20190322508
    Abstract: A pallet truck includes a front frame having at least one fork and being connected to a drive unit through a lift cylinder, a plug-in battery assembly, a hydraulic supply system and a plug-in controller assembly connected to the front frame, and an operator handle connected to the drive unit. The pallet truck may include a rear frame having caster wheel assemblies that are mounted from above, and where the rear frame is connected to the drive unit.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 24, 2019
    Inventors: Wu Lili, Huang Chao, Ma Qichen, Dai Jincai, Xu Nengzi
  • Publication number: 20190304842
    Abstract: A method for forming a FinFET device is described. The method includes the following steps. A substrate is patterned to form fins. Dummy gate stack is formed on the substrate and over the fins, wherein the dummy gate stack may be formed by the following steps: a dummy layer is formed; a first etching step is performed on the dummy layer with a bromine containing etching gas to form a dummy strip; a second etching step is performed on the dummy strip with a chlorine containing etching gas to form the dummy gate stack. The dummy gate stack is replaced with a gate stack.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Chien Li, Wei-Shuo Ho, Huang-Chao Chang, Wei-Zhe Jhang
  • Patent number: D874083
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: January 28, 2020
    Assignee: Zhejiang E-P Equpiment Co., Ltd.
    Inventors: Huang Chao, Ma Qichen, Wu Lili, Weng Lijian, Xu Linjie
  • Patent number: D903970
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: December 1, 2020
    Inventors: Huang Chao, Ma Qichen, Wu Lili, Weng Lijian, Xu Linjie
  • Patent number: D903971
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: December 1, 2020
    Inventors: Huang Chao, Ma Qichen, Wu Lili, Weng Lijian, Xu Linjie
  • Patent number: D962584
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: August 30, 2022
    Inventors: Yu Jiandong, Lin Zuqian, Xu Minghui, Huang Chao, Ma Qichen
  • Patent number: D972806
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: December 13, 2022
    Inventors: Yu Jiandong, Lin Zuqian, Xu Minghui, Huang Chao, Ma Qichen
  • Patent number: D972807
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: December 13, 2022
    Inventors: Yu Jiandong, Lin Zuqian, Xu Minghui, Huang Chao, Ma Qichen