Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a priority of first finger circuits of the first sensing circuit and a priority of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

Abstract: A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.

Abstract: A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.