Abstract: A memory heat sink is mainly used to provide the memory unit with increased heat dissipation and protection. The memory unit, which is sandwiched in between the bilateral heat spreaders gripped by clips, can be free from dust and have increased heat dissipation. The thermal conduction unit, which perches on the bilateral heat spreaders, can be adjusted to any desirable angle by slightly lifting up the clips. Such angle adjustment made in an easy and simple way would assure performance of a plurality of memory heat sinks, which is applicable to a plurality of memory units inserted in sockets on a main board. The angle adjustment would keep the memory heat sinks spaced to each other so as to increase the heat dissipation.