Abstract: A method for laying out wide metal lines with embedded contacts/vias that has improved process window and an electronic substrate that has having such layout exposed and developed thereon are provided. In the method, the wide metal lines are provided with zig-zag shaped borders in either a waveform or in an interlacing form such that a processing window that is at least 5% larger than the line-to-line spacing for straight-line bordered metal lines is achieved. In a wave form, each one of contacts/vias of the first metal line is positioned juxtaposed to a corresponding contact/via in the second metal line. In the interlacing form, each of the contacts/vias being positioned juxtaposed to a pre-set spacing in between the contacts/vias in the second metal line. Both the wave and interlacing form wide metal lines layout can be used to improve the process window during a photolithographic process.