Patents by Inventor Huang Ching Juinn

Huang Ching Juinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7247575
    Abstract: An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 24, 2007
    Inventors: Chiu Sung Cheng, Wu Ming Che, Hung Shih Lei, Huang Ching Juinn