Patents by Inventor Huang Chuan-Yi

Huang Chuan-Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide resin and cast-on-copper laminate
    Publication number: 20050112362
    Abstract: A polyimide polymer made from a dianhydride of 3,3?,4,4?-Biphenyltetracarboxylic dianhydride and diamines of p-phenylenediamine and oxydianiline, having similar coefficient of thermal expansion, useful for producing polyimide cast-on-copper laminate, which having an excellent dimensional stability.
    Type: Application
    Filed: November 2, 2004
    Publication date: May 26, 2005
    Inventors: Hsu Yen-Huey, Huang Chuan-Yi
  • Polyimide resin and cast-on-copper laminate
    Publication number: 20040260053
    Abstract: A polyimide polymer made from a dianhydride of 3,3′,4,4′-Biphenyltetracarboxylic dianhydride and diamines of p-phenylenediamine and oxydianiline, having similar coefficient of thermal expansion, useful for producing polyimide cast-on-copper laminate, which having an excellent dimensional stability.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Hsu Yen-Huey, Huang Chuan-Yi
  • Opaque polyimide coverlay
    Publication number: 20040142191
    Abstract: The present invention relates to an opaque polyimide coverlay, which is made of a transparent protection coverfilm coating with black epoxy adhesive, wherein the opaque polyimide using a transparent and heat resistant polyimide film is used as a protection coverfilm instead of using a higher cost of black polyimide film and using a black epoxy adhesive comprising carbon black powder instead of using a common epoxy adhesive.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 22, 2004
    Applicant: THINFLEX CORPORATION
    Inventors: Wang Mei-Yen, Huang Chuan-Yi, Jiang Ying-Teh