Patents by Inventor Huang-Hua Wen

Huang-Hua Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9123981
    Abstract: A tunable radio frequency (RF) coupler and manufacturing method thereof are provided. The tunable RF coupler includes an insulating layer, a first transmission line and a second transmission line. The second transmission line is disposed corresponding to the first transmission line and the insulating layer is disposed between the first transmission line and the second transmission line. The second transmission line includes a plurality of segments separated from each other and arranged along the extension path of the first transmission line. At least one wire is configured to establish an electrical connection between at least two segments, such that the two segments are electrically conductive to each other through the wire.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: September 1, 2015
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Chien-Yeh Liu, Wei-Hsuan Lee, Jaw-Ming Ding, Huang-Hua Wen
  • Publication number: 20150244053
    Abstract: A tunable radio frequency (RF) coupler and manufacturing method thereof are provided. The tunable RF coupler includes an insulating layer, a first transmission line and a second transmission line. The second transmission line is disposed corresponding to the first transmission line and the insulating layer is disposed between the first transmission line and the second transmission line. The second transmission line includes a plurality of segments separated from each other and arranged along the extension path of the first transmission line. At least one wire is configured to establish an electrical connection between at least two segments, such that the two segments are electrically conductive to each other through the wire.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 27, 2015
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
    Inventors: CHIEN-YEH LIU, Wei-Hsuan Lee, JAW-MING DING, Huang-Hua Wen