Abstract: The present disclosure provides a matrix device and an operation method thereof. The matrix device includes a transpose circuit and a memory. The transpose circuit is configured to receive a first element string representing a native matrix from a matrix source, wherein all elements in the native matrix are arranged in the first element string in one of a “row-major manner” and a “column-major manner”. The transpose circuit transposes the first element string into a second element string, wherein the second element string is equivalent to an element string in which all elements of the native matrix are arranged in another one of the “row-major manner” and the “column-major manner”. The memory is coupled to the transpose circuit to receive the second element string.

Abstract: Aspects of the present disclosure provide a method for training a predictor that predicts performance of a plurality of machine learning (ML) models on platforms. For example, the method can include converting each of the ML models into a plurality of instructions or the instructions and a plurality of intermediate representations (IRs). The method can also include simulating execution of the instructions corresponding to each of the ML models on a platform and generating instruction performance reports. Each of the instruction performance reports can be associated with performance of the instructions corresponding to one of the ML models that are executed on the platform. The method can also include training the predictor with the instructions or the IRs as learning features and the instruction performance reports as learning labels, compiling the predictor into a library file, and storing the library file in a storage device.

Abstract: An image sensor includes a plurality of liquid-lens units, which include: a lower electrode and an upper electrode; a dielectric layer disposed between the lower electrode and the upper electrode; a containment space disposed between the dielectric layer and the upper electrode; and a non-polar liquid and a polar liquid filled into the containment space, wherein the non-polar liquid and the polar liquid are immiscible with each other. The non-polar liquid is configured to occupy a first contact area on the dielectric layer under a first voltage, and a second contact area on the dielectric layer under a second voltage. The first contact area is larger than the second contact area, and the second voltage is higher than the first voltage.

Abstract: An optical element is provided. The optical element includes a substrate; a plurality of metal grids formed on the substrate; an oxide layer formed on the substrate between the plurality of metal grids; and a plurality of organic layers formed on the plurality of metal grids, wherein the width of the organic layer is greater than the width of the metal grid, and there is at least one gap between the organic layer and the oxide layer.

Abstract: An image sensor is provided. The image sensor includes a substrate, an isolation structure on the substrate, a photoelectric conversion layer, a transparent electrode layer, an encapsulation layer, a color filter layer, and a micro-lens. The isolation structure is electrically non-conductive and defines a plurality of pixel regions on the substrate. The isolation structure prevents cross-talk of electrical signals among pixels. The photoelectric conversion layer is disposed on the pixel regions defined by the isolation structure. The transparent electrode layer is disposed over the isolation structure and the photoelectric conversion layer. The encapsulation layer is disposed over the transparent electrode layer. The micro-lens is disposed on the color filter layer.

Abstract: An image sensor includes: a substrate; color filter units disposed on the substrate; and a grid structure disposed on the substrate and surrounding each of the color filter units. The grid structure includes: a first partition wall, disposed on the substrate, located between the color filter units; and a second partition wall, disposed directly on the first partition wall, located between the color filter units. A top width of the second partition wall is smaller than a bottom width of the second partition wall.

Abstract: A solid-state imaging device having flat microlenses is provided. The solid-state imaging device includes a semiconductor substrate having a plurality of photoelectric conversion elements. The solid-state imaging device further includes a color filter layer disposed above the semiconductor substrate. The solid-state imaging device also includes a microlens having a flat top surface disposed on the color filter layer. The flat top surface of the microlens is directly above the photoelectric conversion element, and the area of the flat top surface of the microlens is equal to the area of the photoelectric conversion element.

Abstract: An optical element is provided. The optical element includes a substrate; a plurality of metal grids formed on the substrate; an oxide layer formed on the substrate between the plurality of metal grids; and a plurality of organic layers formed on the plurality of metal grids, wherein the width of the organic layer is greater than the width of the metal grid, and there is at least one gap between the organic layer and the oxide layer.

Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.

Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.

Abstract: A solid-state imaging device having flat microlenses is provided. The solid-state imaging device includes a semiconductor substrate having a plurality of photoelectric conversion elements. The solid-state imaging device further includes a color filter layer disposed above the semiconductor substrate. The solid-state imaging device also includes a microlens having a flat top surface disposed on the color filter layer. The flat top surface of the microlens is directly above the photoelectric conversion element, and the area of the flat top surface of the microlens is equal to the area of the photoelectric conversion element.

Abstract: Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.

Abstract: Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.

Abstract: An image sensing device includes: an active layer with a plurality of photo-sensing elements; a color pattern disposed over one of the photo-sensing elements, wherein the color pattern has a color selected from the group consisting of red (R), green (G), and blue (B); a microlens disposed on the color pattern; and a transmissive pattern being adjacent to the color pattern and over another one of the photo-sensing elements, wherein the transmissive pattern includes a color filter portion and a microlens portion, and an absolute value of a difference of refractive indexes between the microlens and the color pattern is less than 0.3, and there is no difference of refractive indexes between the microlens portion and the color filter portion of the transmissive pattern.

Abstract: A mobile communication device is provided and includes a plastic frame body, a metal outer frame, a metal inner frame and a first conductive spring. The plastic frame body has an opening, a first locking groove, a first inserting groove and a first protrusive portion formed between the first locking groove and the first inserting groove. The metal outer frame is locked to the first locking groove and fixed on the outside of the plastic frame body. The metal inner frame is inserted into the first inserting groove and fixed in the surroundings of the opening of the plastic frame body. Besides, the metal inner frame is electrically connected to a system ground plane. The first conductive spring clasps the first protrusive portion. The first conductive spring extends into the first locking groove and the first inserting groove so as to electrically connect the metal outer and inner frames.

Abstract: An image sensing device includes: an active layer with a plurality of photo-sensing elements; a color pattern disposed over one of the photo-sensing elements, wherein the color pattern has a color selected from the group consisting of red (R), green (G), and blue (B); a microlens disposed on the color pattern; and a transmissive pattern being adjacent to the color pattern and over another one of the photo-sensing elements, wherein the transmissive pattern includes a color filter portion and a microlens portion, and an absolute value of a difference of refractive indexes between the microlens and the color pattern is less than 0.3, and there is no difference of refractive indexes between the microlens portion and the color filter portion of the transmissive pattern.

Abstract: A handheld device is disclosed, which includes an appearance part, a system ground plane and a detachable element. The detachable element includes a carrier and a planar antenna. The system ground plane is disposed in the appearance part and has a feed point. The planar antenna is disposed on the carrier and has a connection point. The carrier is detachably connected to the appearance part. When the carrier is connected to the appearance part, the above-mentioned connection point is electrically connected to the feed point. In this way, the radiation performance of the antenna can be improved and the frequency band of the antenna of the handheld device can be changed by replacing the detachable element.

Abstract: A manufacturing method of microlenses includes providing a substrate; forming a microlens material on the substrate; disposing a mask over the microlens material; performing an exposure process by a radiant beam emitted to the microlens material via the mask; performing a developing process on the microlens material; and forming microlenses by performing a reflow process on the microlens material.

Abstract: A light guide bar and an optical touch panel utilizing the light guide bar are provided. The light guide bar is applied to an optical touch panel with a sensing area. The light guide bar includes a bar body and a plurality of prisms. The bar body has a first receiving end, a light-exiting surface, and a structure surface. The light-exiting surface is opposite to the structure surface and faces the sensing area while the first receiving end is connected between an end of the light-exiting surface and an end of the structure surface. The prisms are formed on the structure surface. Each prism includes a first surface and a second surface respectively having a first angle and a second angle with respect to the structure surface, wherein the second surface is closer to the first receiving end than the first surface, and the second angle is larger than or equal to the first angle.

Abstract: A mobile communication device is provided and includes a plastic frame body, a metal outer frame, a metal inner frame and a first conductive spring. The plastic frame body has an opening, a first locking groove, a first inserting groove and a first protrusive portion formed between the first locking groove and the first inserting groove. The metal outer frame is locked to the first locking groove and fixed on the outside of the plastic frame body. The metal inner frame is inserted into the first inserting groove and fixed in the surroundings of the opening of the plastic frame body. Besides, the metal inner frame is electrically connected to a system ground plane. The first conductive spring clasps the first protrusive portion. The first conductive spring extends into the first locking groove and the first inserting groove so as to electrically connect the metal outer and inner frames.