Patents by Inventor Huang Juinn

Huang Juinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060003591
    Abstract: An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Chiu Cheng, Wu Che, Hung Lei, Huang Juinn