Patents by Inventor HUANG-KAI SHEN

HUANG-KAI SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11822204
    Abstract: An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: November 21, 2023
    Assignee: E INK HOLDINGS INC.
    Inventors: Jen-Shiun Huang, Huang-Kai Shen, Ko-Fan Tu
  • Publication number: 20210325758
    Abstract: An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.
    Type: Application
    Filed: March 9, 2021
    Publication date: October 21, 2021
    Applicant: E Ink Holdings Inc.
    Inventors: Jen-Shiun HUANG, Huang-Kai SHEN, Ko-Fan TU
  • Patent number: 11054740
    Abstract: An imprint mold and a method for manufacturing the same are provided. The imprint mold includes a plurality of substantially identical or different mold patterns, wherein there isn't any height difference between the mold patterns.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: July 6, 2021
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Sheng-Ming Huang, Sheng-Kai Lin, Chih-Chiang Chen, Hui-Ku Chang, Chia-Hsin Chung, Wei-Chi Wang, Ming-Jui Wang, Jen-Kuei Lu, Tsai-Sheng Lo, Huang-Kai Shen
  • Patent number: 10802189
    Abstract: A wire grid polarizer and a display panel using the same are provided. The wire grid polarizer includes a substrate, a plurality of wire grids, a plurality of patterned light absorbing layers, and a surface covering layer. The plurality of wire grids are disposed on the substrate, wherein there are a plurality of gaps between every two wire grids. The plurality of patterned light absorbing layers are disposed corresponding to and overlapping the wire grids respectively, wherein every two of the patterned light absorbing layers have one of the gaps. The surface covering layer is disposed on the patterned light absorbing layers and directly contacts the patterned light absorbing layers.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: October 13, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Huang-Kai Shen, Sheng-Ming Huang, Jen-Kuei Lu, Chih-Chiang Chen, Hui-Ku Chang, Tsai-Sheng Lo, Chia-Hsin Chung, Wei-Chi Wang, Sheng-Kai Lin, Ming-Jui Wang
  • Publication number: 20190094435
    Abstract: A wire grid polarizer and a display panel using the same are provided. The wire grid polarizer includes a substrate, a plurality of wire grids, a plurality of patterned light absorbing layers, and a surface covering layer. The plurality of wire grids are disposed on the substrate, wherein there are a plurality of gaps between every two wire grids. The plurality of patterned light absorbing layers are disposed corresponding to and overlapping the wire grids respectively, wherein every two of the patterned light absorbing layers have one of the gaps. The surface covering layer is disposed on the patterned light absorbing layers and directly contacts the patterned light absorbing layers.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Inventors: HUANG-KAI SHEN, SHENG-MING HUANG, JEN-KUEI LU, CHIH-CHIANG CHEN, HUI-KU CHANG, TSAI-SHENG LO, CHIA-HSIN CHUNG, WEI-CHI WANG, SHENG-KAI LIN, MING-JUI WANG
  • Publication number: 20190079394
    Abstract: An imprint mold and a method for manufacturing the same are provided. The imprint mold includes a plurality of substantially identical or different mold patterns, wherein there isn't any height difference between the mold patterns.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Inventors: SHENG-MING HUANG, SHENG-KAI LIN, CHIH-CHIANG CHEN, HUI-KU CHANG, CHIA-HSIN CHUNG, WEI-CHI WANG, MING-JUI WANG, JEN-KUEI LU, TSAI-SHENG LO, HUANG-KAI SHEN