Patents by Inventor Huang-Pin Shen

Huang-Pin Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200232468
    Abstract: A fan frame structure includes a frame body. An outer circumference of the frame body is formed with at least one locking hole. A reinforcement member is correspondingly disposed in the locking hole. The reinforcement member is formed with a through hole. By means of the structural design of the fan frame structure, the structural strength of the fan frame body is greatly enhanced so that the damage ratio of the frame body is lowered.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 23, 2020
    Inventor: Huang-Pin Shen
  • Patent number: 10215499
    Abstract: A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 26, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Publication number: 20170038153
    Abstract: A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Publication number: 20170042064
    Abstract: A thermal module includes a heat pipe and a heat dissipation unit. The heat pipe has a main body and at least one first heat conduction section integrally radially and axially extending from a circumference of the main body. The heat dissipation unit has multiple radiating fins. The radiating fins are arranged at intervals. Each radiating fin is formed with a perforation. At least one first locating slit outward extend from the perforation. The main body and the first heat conduction section are respectively correspondingly fitted through the perforations and the first locating slits to tightly connect the heat pipe with the heat dissipation unit. The first heat conduction section of the heat pipe provides much larger heat conduction area for the heat pipe so that the heat conduction effect of the heat dissipation unit is greatly enhanced and the heat dissipation performance and efficiency are enhanced.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventors: Chih-Peng Chen, Huang-Pin Shen