Abstract: A diode package for series circuit includes a plurality of conductive bearing frames, a plurality of diode chips and a plurality of conductive bridging frames. Each the bearing frame has a chip setting portion or a bridging portion, or has a chip setting portion and a bridging portion bent in the chip setting portion. Each the diode chip is disposed on each chip setting portion. Each the bridging frame bridges between two adjacent bearing frames. Two ends of each the bridging frame are respectively connected to each the diode chip and each the bridging portion to form a series structure.