Patents by Inventor Huang-Wen Chen

Huang-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9864363
    Abstract: A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: January 9, 2018
    Assignee: Powerchip Technology Corporation
    Inventors: Jyun-Da Wu, Shih-Tsung Hsiao, Chien-Chung Chen, Huang-Wei Wu, Huang-Wen Chen, Sheng-Hsiu Peng
  • Publication number: 20160047045
    Abstract: A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 18, 2016
    Inventors: Jyun-Da Wu, Shih-Tsung Hsiao, Chien-Chung Chen, Huang-Wei Wu, Huang-Wen Chen, Sheng-Hsiu Peng
  • Patent number: 6367483
    Abstract: A hairdye comb has a bottle-shaped handle having a neck, a connection disk, a comb strip, a tube passing through the connection disk, a hollow seat connected to the comb strip, a plurality of teeth disposed on the comb strip, and a plurality of slots formed on the comb strip. The connection disk has a valve diaphragm and a through hole. The pipe has an inner flange. The ball is inserted in the pipe. The hose is connected to the pipe and the tube. The connection disk is inserted in the neck of the bottle-shaped handle. The neck of the bottle-shaped handle is inserted in the hollow seat.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: April 9, 2002
    Inventors: Huang-Wen Chen, Suz-Chou Yang
  • Patent number: 6120611
    Abstract: An apparatus and a method for hermetically sealing a vacuum process chamber substantially without frictional force are provided. In the apparatus, a ball bearing is used between a door and a loader stage for facilitating the mounting of the former to the latter. A photosensing element is used which consists of a traversing flag mounted on a loader stage onto which a door is mounted, and a stationary photo transmitter/receiver mounted on the structure onto which a furnace tube is installed. The photosensing device enables the determination of the state of engagement between the door on the cantilever loader assembly and the flange on the furnace tube without any mechanical contact or frictional force occurring in the sensing device. A poorly mated interface between the door and the flange can thus be avoided and a substantially more reliable seal can be achieved between the sealing members.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: September 19, 2000
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuen Lin Guan, Huang Wen Chen, Wen Shing Liang
  • Patent number: D451244
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: November 27, 2001
    Inventors: Huang-Wen Chen, Suz-Chou Yang
  • Patent number: D459027
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: June 18, 2002
    Inventors: Huang-Wen Chen, Suz-Chou Yang
  • Patent number: D1063157
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: February 18, 2025
    Assignee: SHIANG JIUN PRECISION INDUSTRY CO., LTD.
    Inventor: Huang-Wen Chen