Patents by Inventor Huanglin Li

Huanglin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dynamic determination of metal film thickness from sheet resistance and TCR value
    Patent number: 10663279
    Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: May 26, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Xianghua Liu, Walter Johnson, Jianli Cui, Lu Yu, Nanchang Zhu, Juli Cheng, Huanglin Li, Liming Liu
  • Dynamic determination of metal film thickness from sheet resistance and TCR value
    Patent number: 10598477
    Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: March 24, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Xianghua Liu, Walter Johnson, Jianli Cui, Lu Yu, Nanchang Zhu, Juli Cheng, Huanglin Li, Liming Liu
  • Dynamic Determination of Metal Film Thickness from Sheet Resistance and TCR Value
    Publication number: 20170227347
    Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 10, 2017
    Inventors: Xianghua Liu, Walter Johnson, Jianli Cui, Lu Yu, Nanchang Zhu, Juli Cheng, Huanglin Li, Liming Liu
  • Dynamic Determination of Metal Film Thickness from Sheet Resistance and TCR Value
    Publication number: 20170227348
    Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 10, 2017
    Inventors: Xianghua Liu, Walter Johnson, Jianli Cui, Lu Yu, Nanchang Zhu, Juli Cheng, Huanglin Li, Liming Liu