Patents by Inventor Huangwei HUANG

Huangwei HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11640513
    Abstract: An RFID security tape having: a layer of tamper-evident tape; a layer of an RFID inlay; a blocking layer; a layer of metal foil having an adhesive bottom surface; and a layer of a release liner, wherein all layers of the RFID security tape are in adhesive connection with each other and wherein the layer of the RFID inlay is configured to be damaged when the RFID security tape has been applied to an asset and the layer of tamper-evident tape is subsequently removed from the asset.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 2, 2023
    Assignee: Ascent Solutions Pte Ltd
    Inventors: Chee Kean Lim, Kia Boon Chew, Xiaojing Wu, Huangwei Huang
  • Publication number: 20210182644
    Abstract: An RFID security tape comprising: a layer of tamper-evident tape; a layer of an RFID inlay; a blocking layer; a layer of metal foil having an adhesive bottom surface; and a layer of a release liner, wherein all layers of the RFID security tape are in adhesive connection with each other and wherein the layer of the RFID inlay is configured to be damaged when the RFID security tape has been applied to an asset and the layer of tamper-evident tape is subsequently removed from the asset.
    Type: Application
    Filed: June 28, 2018
    Publication date: June 17, 2021
    Inventors: Chee Kean LIM, Kia Boon CHEW, Xiaojing WU, Huangwei HUANG