Patents by Inventor Huanhuan WU

Huanhuan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075474
    Abstract: A biosensing platform for in-situ sampling and target detection based on upconversion luminescence, including: an upconversion luminescent paper-based microfluidic device, an upconversion luminescent biosensor, and a portable detection device based on smartphone imaging. The upconversion luminescent paper-based microfluidic device is configured to sample a to-be-detected substance in situ. The upconversion luminescent biosensor is configured to allow a target to specifically recognize the to-be-detected substance. The portable detection device is configured to detect a content of the to-be-detected substance. The upconversion luminescent biosensor is prepared as follows. (S1) An upconversion nanoparticle seed is prepared. (S2) Core-shell upconversion nanoparticles are prepared. (S3) Core-shell-shell upconversion nanoparticles (UCNPs) are prepared. (S4) The UCNPs is subjected to hydrophilic modification. (S5) The hydrophilically-modified UCNPs are modified with DNA.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 7, 2024
    Inventors: Quansheng CHEN, Jizhong WU, Qin OUYANG, Wenya WEI, Huanhuan LI, Jingui ZHANG, Jinghao YU
  • Patent number: 11298767
    Abstract: A resistive soldering system, includes a first electrode; a second electrode; a support cylinder; a resistive soldering joint which is adapted to raise or lower the first electrode, the second electrode and the support cylinder; and a power supply unit which is connected with the first and second electrodes and adapted to supply power and a heating current to the first and second electrodes.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: April 12, 2022
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Ce Shi, Shengwen Yu, Huanhuan Wu
  • Patent number: 10977533
    Abstract: A vehicle windshield with a two-dimensional code includes a first glass, a second glass and an intermediate film provided between the first glass and the second glass. The first glass includes a first surface facing the exterior of a vehicle and a second surface adhered to the intermediate film, while the second glass includes a third surface adhered to the intermediate film and a fourth surface facing the interior of the vehicle. Black enamel paint is printed on the second surface and/or the fourth surface. The second surface or the fourth surface is provided with a two-dimensional code printed with enamel paint at a position corresponding to the black enamel paint. The two-dimensional code contains unique information of the glass and/or the vehicle.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: April 13, 2021
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Ce Shi, Huanhuan Wu
  • Publication number: 20200257948
    Abstract: A vehicle windshield with a two-dimensional code includes a first glass, a second glass and an intermediate film provided between the first glass and the second glass. The first glass includes a first surface facing the exterior of a vehicle and a second surface adhered to the intermediate film, while the second glass includes a third surface adhered to the intermediate film and a fourth surface facing the interior of the vehicle. Black enamel paint is printed on the second surface and/or the fourth surface. The second surface or the fourth surface is provided with a two-dimensional code printed with enamel paint at a position corresponding to the black enamel paint. The two-dimensional code contains unique information of the glass and/or the vehicle.
    Type: Application
    Filed: December 25, 2018
    Publication date: August 13, 2020
    Inventors: Ce SHI, Huanhuan WU
  • Publication number: 20200246895
    Abstract: A resistive soldering system, includes a first electrode; a second electrode; a support cylinder; a resistive soldering joint which is adapted to raise or lower the first electrode, the second electrode and the support cylinder; and a power supply unit which is connected with the first and second electrodes and adapted to supply power and a heating current to the first and second electrodes.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Inventors: Ce SHI, Shengwen YU, Huanhuan WU
  • Patent number: 10668549
    Abstract: A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: June 2, 2020
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Ce Shi, Shengwen Yu, Huanhuan Wu
  • Publication number: 20190283162
    Abstract: A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.
    Type: Application
    Filed: May 4, 2017
    Publication date: September 19, 2019
    Inventors: Ce SHI, Shengwen YU, Huanhuan WU