Abstract: A driver circuit may include a source, a first circuit path, and a second circuit path. The a first circuit path may be connected to the source and include a first anode pad, a first set of connecting elements to connect the first anode pad to an anode of an optical load, a second anode pad that is separate from the first anode pad, a second set of connecting elements to connect the anode of the optical load to the second anode pad, and a switch. The switch being in a closed state causes current to charge the first set of connecting elements and the second set of connecting elements through the first circuit path. The switch transitioning from the closed state to the open state causes the first set of connecting elements to discharge current through the second circuit path to provide an electrical pulse to the optical load.

Abstract: In some implementations, an emitter module may include an emitter layer including a first emitter array configured to produce a first beam that provides flood illumination, and a second emitter array configured to produce a second beam that provides spot illumination. The emitter module may include a first optics layer, positioned in front of the emitter layer, that includes a first collimating lens positioned in front of the first emitter array, and a second collimating lens positioned in front of the second emitter array. The emitter module may include a second optics layer, positioned in front of the first optics layer, that includes an optical diffuser positioned in front of the first collimating lens, and a beamsplitter grating positioned in front of the second collimating lens.

Abstract: In some implementations, a vertical cavity surface emitting laser (VCSEL) package may include a substrate. The VCSEL package may include a VCSEL disposed on a surface of the substrate. The VCSEL package may include a VCSEL driver disposed on the surface of the substrate. The VCSEL package may include an embedded capacitor electrically connected to the VCSEL and the VCSEL driver. The embedded capacitor may be formed from a subset of layers of the substrate. The capacitor may be associated with a first capacitance that is different from a second capacitance of at least one other capacitor associated with the substrate.

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

Abstract: A circuit (e.g., for use in a time-of-flight camera projector module) may include a top metal layer having an anode and a cathode, one or more capacitors connected to the anode, a vertical-cavity surface-emitting laser connected to the anode and the cathode, and a driver connected to the cathode. The circuit may further include a bottom metal layer connected to ground and arranged below the top metal layer, and a dielectric layer separating the top metal layer and the bottom metal layer. In some implementations, the dielectric layer has a thickness under sixty micrometers and a thermal resistance under fifteen degrees Celsius per watt. Accordingly, a current loop flowing vertically across the dielectric layer has a low self-inductance based on the thickness of the dielectric layer and the bottom metal layer is arranged to dissipate heat generated by the current loop flowing vertically across the dielectric layer.

Abstract: A driver circuit may include a source, a first circuit path, and a second circuit path. The a first circuit path may be connected to the source and include a first anode pad, a first set of connecting elements to connect the first anode pad to an anode of an optical load, a second anode pad that is separate from the first anode pad, a second set of connecting elements to connect the anode of the optical load to the second anode pad, and a switch. The switch being in a closed state causes current to charge the first set of connecting elements and the second set of connecting elements through the first circuit path. The switch transitioning from the closed state to the open state causes the first set of connecting elements to discharge current through the second circuit path to provide an electrical pulse to the optical load.

Abstract: An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.

Abstract: In some implementations, an emitter module may include an emitter layer including a first emitter array configured to produce a first beam that provides flood illumination, and a second emitter array configured to produce a second beam that provides spot illumination. The emitter module may include a first optics layer, positioned in front of the emitter layer, that includes a first collimating lens positioned in front of the first emitter array, and a second collimating lens positioned in front of the second emitter array. The emitter module may include a second optics layer, positioned in front of the first optics layer, that includes an optical diffuser positioned in front of the first collimating lens, and a beamsplitter grating positioned in front of the second collimating lens.

Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.