Abstract: A computer cabinet includes a radiating aluminium substrate; a case cover upturned above the radiating aluminium substrate to form a motherboard installation space between the radiating aluminium substrate and the case cover; and a motherboard installed in the motherboard installation space, and a CPU of the motherboard contacting closely with an upper surface of the radiating aluminium substrate. The radiating aluminium substrate in the disclosure is directly connected to the CPU of the motherboard, thus playing the role of active cooling, so that the computer can run in a noiseless state. Therefor there is no need to use a fan to dissipate heat, accordingly dust will not be inhaled through an air duct, thus enhancing host stability and extending service life.

Abstract: A secondary development and revision method for the motherboard based on heat management, wherein the secondary development and revision is carried out according to the public PCB issued by the motherboard chip supplier, euthermic chips are classified according to the size of heat and operating temperature range of the euthermic chips to match the power of the heat dissipation device used; at the same time, taking into account the size specifications and position of connector, in the condition of forming a smooth air flow channel as far as possible, the euthermic chips are arranged on both sides of the motherboard. The disclosure realizes the scattered arrangement of the heating components on the motherboard, improves the heat accumulation condition inside the product in essence, makes the cooling channel more direct, and improves the heat dissipation cost, power consumption, conduction medium and reliability of the product.