Patents by Inventor Huantao Duan

Huantao Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230268243
    Abstract: A semiconductor device includes a substrate, and an epitaxial layer and an electrode that are located on the substrate. The substrate has a diamond structure that longitudinally penetrates the substrate. The diamond structure may be longitudinally divided into a first diamond part and a second diamond part below the first diamond part. The first diamond part and the second diamond part have different lateral dimensions.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 24, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bin Hu, Huantao Duan