Abstract: An edge coupling device including a substrate, a buried oxide disposed over the substrate, a cladding material disposed over the buried oxide, where the cladding material includes a trench, an inversely tapered silicon waveguide disposed within the cladding material beneath the trench, and a ridge waveguide disposed within the trench, where the ridge waveguide and the inversely tapered silicon waveguide are vertically-aligned with each other.

Abstract: An apparatus comprises a substrate comprising a silicon dioxide (SiO2) material disposed on top of the substrate, a silicon waveguide comprising a first adiabatic tapering and enclosed in the silicon dioxide material, and a low-index waveguide disposed on top of the substrate and adjacent to the first adiabatic tapering. A mode converter fabrication method comprises obtaining a mode converter comprising a substrate, a silicon waveguide disposed on the substrate and comprising a sidewall and a first adiabatic tapering, and a hard mask disposed on the silicon waveguide and comprising a silicon dioxide layer, wherein the hard mask does not cover the sidewall, and oxidizing the silicon waveguide and the hard mask, wherein oxidizing the silicon waveguide and the hard mask encloses the silicon waveguide within the silicon dioxide layer.

Abstract: An apparatus comprises a substrate comprising a silicon dioxide (SiO2) material disposed on top of the substrate, a silicon waveguide comprising a first adiabatic tapering and enclosed in the silicon dioxide material, and a low-index waveguide disposed on top of the substrate and adjacent to the first adiabatic tapering. A mode converter fabrication method comprises obtaining a mode converter comprising a substrate, a silicon waveguide disposed on the substrate and comprising a sidewall and a first adiabatic tapering, and a hard mask disposed on the silicon waveguide and comprising a silicon dioxide layer, wherein the hard mask does not cover the sidewall, and oxidizing the silicon waveguide and the hard mask, wherein oxidizing the silicon waveguide and the hard mask encloses the silicon waveguide within the silicon dioxide layer.

Abstract: An edge coupling device including a substrate, a buried oxide disposed over the substrate, a cladding material disposed over the buried oxide, where the cladding material includes a trench, an inversely tapered silicon waveguide disposed within the cladding material beneath the trench, and a ridge waveguide disposed within the trench, where the ridge waveguide and the inversely tapered silicon waveguide are vertically-aligned with each other.

Abstract: An apparatus comprises a substrate comprising a silicon dioxide (SiO2) material disposed on top of the substrate, a silicon waveguide comprising a first adiabatic tapering and enclosed in the silicon dioxide material, and a low-index waveguide disposed on top of the substrate and adjacent to the first adiabatic tapering. A mode converter fabrication method comprises obtaining a mode converter comprising a substrate, a silicon waveguide disposed on the substrate and comprising a sidewall and a first adiabatic tapering, and a hard mask disposed on the silicon waveguide and comprising a silicon dioxide (SiO2) layer, wherein the hard mask does not cover the sidewall, and oxidizing the silicon waveguide and the hard mask, wherein oxidizing the silicon waveguide and the hard mask encloses the silicon waveguide within the silicon dioxide layer.

Abstract: A method of fabricating an edge coupling device and an edge coupling device are provided. The method includes removing a portion of cladding material to form a trench over an inversely tapered silicon waveguide, depositing a material having a refractive index greater than silicon dioxide over remaining portions of the cladding material and in the trench, and removing a portion of the material within the trench to form a ridge waveguide.

Abstract: An apparatus comprising a waveguide along a longitudinal axis at a first elevation, an optical splitter coupled to a first edge of the waveguide along the longitudinal axis, two or more inverse tapers coupled to a second edge of the optical splitter along the longitudinal axis, and one or more offset inverse tapers that are substantially parallel with the two or more inverse tapers, wherein the one or more offset inverse tapers are along the longitudinal axis at a second elevation.

Abstract: An apparatus comprising a thick waveguide comprising a first adiabatic tapering from a first location to a second location, wherein the first adiabatic tapering is wider at the first location than at the second location, and a thin slab waveguide comprising a second adiabatic tapering from the first location to the second location, wherein the second adiabatic tapering is wider at the second location than at the first location, and a third adiabatic tapering from the second location to a third location, wherein the third adiabatic tapering is wider at the second location than at the third location, wherein at least a portion of the first adiabatic tapering is adjacent to the second adiabatic tapering, and wherein the first adiabatic tapering and the second adiabatic tapering are separated from each other by a constant gap.

Abstract: A method includes forming a first optical structure with an inverse taper and a separate optical structure on a semiconductor chip. The illustrative method also includes applying a protective structure over the optical structures and patterning the protective structure to expose the separate optical structure. The method further includes removing a portion of the separate optical structure to form a separate trimmed taper separate from, but adjacent to, the first optical structure. The protective structure is then removed from the first optical structure. Apparatuses are also disclosed.

Abstract: An apparatus comprises a substrate comprising a silicon dioxide (SiO2) material disposed on top of the substrate, a silicon waveguide comprising a first adiabatic tapering and enclosed in the silicon dioxide material, and a low-index waveguide disposed on top of the substrate and adjacent to the first adiabatic tapering. A mode converter fabrication method comprises obtaining a mode converter comprising a substrate, a silicon waveguide disposed on the substrate and comprising a sidewall and a first adiabatic tapering, and a hard mask disposed on the silicon waveguide and comprising a silicon dioxide (SiO2) layer, wherein the hard mask does not cover the sidewall, and oxidizing the silicon waveguide and the hard mask, wherein oxidizing the silicon waveguide and the hard mask encloses the silicon waveguide within the silicon dioxide layer.

Abstract: A method of fabricating an edge coupling device and an edge coupling device are provided. The method includes removing a portion of cladding material to form a trench over an inversely tapered silicon waveguide, depositing a material having a refractive index greater than silicon dioxide over remaining portions of the cladding material and in the trench, and removing a portion of the material within the trench to form a ridge waveguide.

Abstract: An apparatus comprising a thick waveguide comprising a first adiabatic tapering from a first location to a second location, wherein the first adiabatic tapering is wider at the first location than at the second location, and a thin slab waveguide comprising a second adiabatic tapering from the first location to the second location, wherein the second adiabatic tapering is wider at the second location than at the first location, and a third adiabatic tapering from the second location to a third location, wherein the third adiabatic tapering is wider at the second location than at the third location, wherein at least a portion of the first adiabatic tapering is adjacent to the second adiabatic tapering, and wherein the first adiabatic tapering and the second adiabatic tapering are separated from each other by a constant gap.

Abstract: An apparatus comprising a waveguide along a longitudinal axis at a first elevation, an optical splitter coupled to a first edge of the waveguide along the longitudinal axis, two or more inverse tapers coupled to a second edge of the optical splitter along the longitudinal axis, and one or more offset inverse tapers that are substantially parallel with the two or more inverse tapers, wherein the one or more offset inverse tapers are along the longitudinal axis at a second elevation.

Abstract: A method of exciting a selected light propagation mode in a device is disclosed. At least two light beams are propagated proximate a waveguide of the device substantially parallel to a selected surface of the waveguide. Light is transferred from the at least two beams of light into the waveguide through the selected surface to excite the selected light propagation mode in the waveguide.

Abstract: A method of exciting a selected light propagation mode in a device is disclosed. At least two light beams are propagated proximate a waveguide of the device substantially parallel to a selected surface of the waveguide. Light is transferred from the at least two beams of light into the waveguide through the selected surface to excite the selected light propagation mode in the waveguide.

Abstract: The monolithic application of a high speed TWPDA with impedance matching. Use of the high speed monolithic TWPDA will allow for more efficient transfer of optical signals within analog circuits and over distances.