Patents by Inventor Hua Ting CHANG

Hua Ting CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit film for smart card
    Patent number: 8644025
    Abstract: An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 4, 2014
    Assignee: Mxtran Inc.
    Inventors: Huan Chin Luo, Hua Ting Chang, Chin Sheng Lin, Chih Cheng Lin, Chung Pei Hung
  • INTEGRATED CIRCUIT FILM FOR SMART CARD
    Publication number: 20110149533
    Abstract: An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 23, 2011
    Applicant: MXTRAN INC.
    Inventors: Huan Chin LUO, Hua Ting CHANG, Chin Sheng LIN, Chih Cheng LIN, Chung Pei HUNG