Patents by Inventor Huawen Jiang

Huawen Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat conduction component and mobile terminal
    Patent number: 10831249
    Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: November 10, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huawen Jiang, Linfang Jin
  • Heat Conduction Component and Mobile Terminal
    Publication number: 20190391623
    Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.
    Type: Application
    Filed: July 31, 2017
    Publication date: December 26, 2019
    Inventors: Huawen Jiang, Linfang Jin