Patents by Inventor Huay Yann Tay

Huay Yann Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-die integrated circuit packages and methods of manufacturing the same
    Patent number: 11328984
    Abstract: Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: May 10, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: You Chye How, Huay Yann Tay, Franklin Santos Marcelino
  • MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20190206772
    Abstract: Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: You Chye How, Huay Yann Tay, Franklin Santos Marcelino
  • INTEGRATED CIRCUIT PACKAGE
    Publication number: 20170053883
    Abstract: An integrated circuit (“IC”) package including at least one IC die having a first side with at least two adjacent bump pads thereon and a second side opposite the first side; a first substrate having a first side with a plurality of electrical contact surfaces thereon; and a plurality of copper pillars, each having a first end attached to one of the adjacent bump pads and a second end attached to one of the electrical contact surfaces.
    Type: Application
    Filed: September 1, 2016
    Publication date: February 23, 2017
    Inventors: You Chye How, Huay Yann Tay
  • INTEGRATED CIRCUIT PACKAGE
    Publication number: 20150262920
    Abstract: An integrated circuit (“IC”) package including at least one IC die having a first side with at least two adjacent bump pads thereon and a second side opposite the first side; a first substrate having a first side with a plurality of electrical contact surfaces thereon; and a plurality of copper pillars, each having a first end attached to one of the adjacent bump pads and a second end attached to one of the electrical contact surfaces.
    Type: Application
    Filed: March 17, 2014
    Publication date: September 17, 2015
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: You Chye How, Huay Yann Tay
  • Integrated passive flip chip package
    Patent number: 9123626
    Abstract: A method for packaging integrated circuit die such that each package includes die with integrated passive components mounted to either the back surface, the active surface or both the back and active surfaces of the die.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: September 1, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: You Chye How, Siew Kee Lee, Huay Yann Tay
  • INTEGRATED PASSIVE FLIP CHIP PACKAGE
    Publication number: 20150243639
    Abstract: A method for packaging integrated circuit die such that each package includes die with integrated passive components mounted to either the back surface, the active surface or both the back and active surfaces of the die.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 27, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: You Chye How, Siew Kee Lee, Huay Yann Tay
  • CARRIER TAPE
    Publication number: 20150053586
    Abstract: A carrier tape for transporting electronic components having a linearly displaceable continuous web and a plurality of pocket structures connected to the continuous web. The pocket structures are adapted to receive the electronic components. Each of the plurality of pocket structures defines an opening to enable passage of the electronic component into the pocket structure. Each of the pocket structures define at least one tab that is adapted to retain an electronic component in the pocket structure without a closure member.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: You Chye How, Siew Kee Lee, Huay Yann Tay