Abstract: A thin stress-free hall-cell package includes a semiconductor hall-cell chip that is completely enveloped by a resilient cushioning material which is in turn held within a cup. The cup is attached to or is a part of at least one of the metal leads. Wires connect the leads to terminal-pads on the chip through the resilient cushioning material. The method for making the package includes providing support for the cup by one or more of the leads, placing the chip in the cup, dispensing a silicone resin into the cup and heat curing the resin. The package is completed with encapsulation of the cup and adjacent lead ends by a hard resin. The cup advantageously has a hole in its bottom such that a chip placed thereover is held in position for wire bonding by evacuating the hole from underneath by means of a vacuum system.

Abstract: A method is described for continuously assembling transistors to a lead frame, capable of high speed production by automatic machinery. A carrier ribbon bearing transistor chips is fed to a work station to which a lead frame is also fed at about right angles thereto. The carrier ribbon end portion bearing one transistor is welded to a terminal of the lead frame and cut to separate it from the remainder of the ribbon. Lead frame strips bearing at least 10 transistors are separated from the remainder of the lead frame and placed in a multi-cavity mold for individually encapsulating the transistors.