Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Abstract: The method of fabricating a suspended microstructure with a sloped support, comprises the steps of (a) providing a member having three stacked up layers including a first substrate layer, a second temporary layer and a third photoresist layer; (b) photolithographically transferring a sloped pattern to the third photoresist layer by means of a grey scale mask; (c) etching the second layer through the third layer resulting from step (b) to obtain a surface with at least one continuous slope with a predetermined angle with respect to the first surface layer; (d) depositing a fourth layer on the previous layers; (e) etching the fourth layer to obtain the sloped support; and (f) removing the second layer to obtain the microstructure with the sloped support. The invention is also concerned with a suspended microstructure fabricated by the method.

Abstract: The microbridge structure comprises a substrate layer provided with two first electrical contacts; a microstructure including a sensing area provided with two second electrical contacts; and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support has two electrically conductive paths made of electrically conductive layers. The two electrically conductive paths connect respectively the two first electrical contacts of the substrate layer to the two second electrical contacts of the microstructure. The micro support extends generally underneath the microstructure, between the microstructure and the substrate layer. The invention also relates to a method for forming the microbridge structure.

Abstract: The microbridge structure comprises a substrate layer provided with two first electrical contacts, a microstructure provided with two second electrical contacts, and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support extends along a vertical axis. The micro support has a central upper cavity extending along the vertical axis within the micro support. The micro support has a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer. The micro support is a multilayer micro support comprising two conductive paths and a layer made of dielectric material. The conductive paths and the layer of the micro support extend from the upper end to the lower end thereof. The two conductive paths connect respectively the two first contacts to the two second contacts.

Abstract: The invention relates to spatial light modulators (SLM) for amplitude and phase modulation of incident light. A "flexure" hinge which is provided between the SLM's substrate and micromirror comprises integral hinged sections which allow for the micromirror to tilt or to move in a piston-like fashion relative to the substrate in response to an electrostatic force. The hinge is particularly advantageous for large mirrors. In addition, the hinge can provide improved heat sinking capability over previously reported SLM hinge designs based on torsion bars and cantilever beams. The flexure hinge has sufficient mechanical flexibility that the SLM actuation voltage required is not excessively high. The flexure hinge has many applications, the preferred ones being a SLM for modulating high-energy beams and a SLM for optical channel switching.

Abstract: The microbridge structure comprises a substrate layer provided with two first electrical contacts, a microstructure provided with two second electrical contacts, and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support extends along a vertical axis. The micro support has a central upper cavity extending along the vertical axis within the micro support. The micro support has a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer. The micro support is a multilayer micro support comprising two conductive paths and a layer made of dielectric material. The conductive paths and the layer of the micro support extend from the upper end to the lower end thereof. The two conductive paths connect respectively the two first contacts to the two second contacts.

Abstract: The microbridge structure is for emitting or detecting radiations. According to one embodiment, it comprises a substrate layer provided with two first electrical contacts, and a microstructure provided with two second electrical contacts and having an underside, a top side opposite to the underside, through which radiations are emitted or received, at least one radiation active layer lying between the underside and the top side, the radiation active layer having two distal points connected respectively to the two second electrical contacts of the microstructure, and a radiation reflective layer lying between the underside and the radiation active layer. It also comprises a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer with the underside of the microstructure facing the substrate layer.