Patents by Inventor Hubert Ryssel

Hubert Ryssel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems, apparatus and methods for bonding and/or sealing electrochemical cell elements and assemblies
    Patent number: 6777127
    Abstract: Apparatus, systems, and methods for bonding one element of an electrochemical cell or cell stack to another wherein a sealing grove with a complex cross-sectional shape receives and retains a bead of adhesive prior to being assembled. The complex cross-sectional shape has a raised portion sized to receive and retain the bead of adhesive, and at least one depressed portion to receive adhesive displaced from the raised portion during assembly. Embodiments of the invention incorporate raised portions with straight, beveled, curved, and rough surfaces to increase the strength of the bond between the respective elements.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: August 17, 2004
    Assignee: Ballard Power Systems Inc.
    Inventors: Johann Einhart, Stefan Reiff, Rudolf F. Bindel, Hubert Ryssel, Christopher Todd Kirby, Francisco Enrique Rivera Diaz, Michael Medina
  • Systems, apparatus and methods for bonding and/or sealing electrochemical cell elements and assemblies
    Publication number: 20020197519
    Abstract: Apparatus, systems, and methods for bonding one element of an electrochemical cell or cell stack to another wherein a sealing grove with a complex cross-sectional shape receives and retains a bead of adhesive prior to being assembled. The complex cross-sectional shape has a raised portion sized to receive and retain the bead of adhesive, and at least one depressed portion to receive adhesive displaced from the raised portion during assembly. Embodiments of the invention incorporate raised portions with straight, beveled, curved, and rough surfaces to increase the strength of the bond between the respective elements.
    Type: Application
    Filed: June 22, 2001
    Publication date: December 26, 2002
    Inventors: Johann Einhart, Stefan Reiff, Rudolf F. Bindel, Hubert Ryssel, Christopher Todd Kirby, Francisco Enrique Rivera Diaz, Michael Medina