Patents by Inventor Hubert Selhofer
Hubert Selhofer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11924974Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.Type: GrantFiled: May 12, 2023Date of Patent: March 5, 2024Assignee: BESI SWITZERLAND AGInventors: Norbert Bilewicz, Andreas Mayr, Hugo Pristauz, Hubert Selhofer
-
Publication number: 20230284426Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Applicant: BESI SWITZERLAND AGInventors: Norbert BILEWICZ, Andreas MAYR, Hugo PRISTAUZ, Hubert SELHOFER
-
Patent number: 11696429Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.Type: GrantFiled: March 9, 2021Date of Patent: July 4, 2023Assignee: BESI SWITZERLAND AGInventors: Norbert Bilewicz, Andreas Mayr, Hugo Pristauz, Hubert Selhofer
-
Publication number: 20210195816Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.Type: ApplicationFiled: March 9, 2021Publication date: June 24, 2021Applicant: BESI SWITZERLAND AGInventors: Norbert BILEWICZ, Andreas MAYR, Hugo PRISTAUZ, Hubert SELHOFER
-
Patent number: 10973158Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.Type: GrantFiled: April 6, 2018Date of Patent: April 6, 2021Assignee: BESI SWITZERLAND AGInventors: Norbert Bilewicz, Andreas Mayr, Hugo Pristauz, Hubert Selhofer
-
Patent number: 10288413Abstract: An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.Type: GrantFiled: September 28, 2016Date of Patent: May 14, 2019Assignee: Besi Switzerland AGInventors: Norbert Bilewicz, Hubert Selhofer
-
Publication number: 20180317353Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.Type: ApplicationFiled: April 6, 2018Publication date: November 1, 2018Applicant: BESI SWITZERLAND AGInventors: Norbert BILEWICZ, Andreas MAYR, Hugo PRISTAUZ, Hubert SELHOFER
-
Publication number: 20170092613Abstract: An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.Type: ApplicationFiled: September 28, 2016Publication date: March 30, 2017Inventors: Norbert Bilewicz, Hubert Selhofer