Patents by Inventor Huck Khim Koay

Huck Khim Koay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulating brittle substrates using transfer molding
    Patent number: 7114939
    Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: October 3, 2006
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Cheng Why Tan, Beng Huat Low, Huck Khim Koay
  • Light source
    Patent number: 6806583
    Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: October 19, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Huck Khim Koay, Seong Choon Lim, Cheng Why Tan, Gurbir Singh A/L Balwant Singh, Chee Keong Chong, Sundar a/l Natarajan Yoganandan
  • Encapsulating brittle substrates using transfer molding
    Publication number: 20030194459
    Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.
    Type: Application
    Filed: February 20, 2003
    Publication date: October 16, 2003
    Inventors: Cheng Why Tan, Beng Huat Low, Huck Khim Koay
  • Light Source
    Publication number: 20020047130
    Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.
    Type: Application
    Filed: June 25, 2001
    Publication date: April 25, 2002
    Inventors: Huck Khim Koay, Seong Choon Lim, Cheng Why Tan, Gurbir Singh A/L Balwant Singh, Chee Keong Chong, Sundar a/I Natarajan Yoganandan
  • Method of interconnecting an electronic device
    Patent number: 6242280
    Abstract: A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Agilent Technologies, Inc.
    Inventors: Huck Khim Koay, Cheng Why Tan, Chee Keong Chong, Gurbir Singh, Sundar A L Natarajan Yoganandan, Seong Choon Lim