Patents by Inventor Huei-Chen Chiang

Huei-Chen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diamond wire saw
    Patent number: 7798888
    Abstract: A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface thereof from flaking off. Thus, the diamond wire saw has improved durability and enhanced sharpness as well as low production cost.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: September 21, 2010
    Inventor: Huei-Chen Chiang
  • Diamond wire saw
    Publication number: 20100175677
    Abstract: A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface thereof from flaking off. Thus, the diamond wire saw has improved durability and enhanced sharpness as well as low production cost.
    Type: Application
    Filed: January 15, 2009
    Publication date: July 15, 2010
    Inventor: Huei-Chen Chiang