Patents by Inventor Huei-Jan Wu

Huei-Jan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130063945
    Abstract: A bulb-type LED lamp having a replaceable light source module includes a lamp head module, a lamp casing module and a light source module. The lamp head module has an electrical-conductive connection portion. One end of the lamp casing module is connected to the lamp head module. The light source module comprises a substrate, a plurality of LEDs electrically connected to the substrate, and a sleeve disposed in the lamp casing module to be electrically connected to the substrate. The sleeve has an electrical-conductive insertion portion assembled with the electrical-conductive connection portion. By this structure, a damaged light source module can be replaced rapidly. A user needs not to by a new whole set lamp so as to save the cost maintenance. Further, a surface thermal contact is generated between the metallic pressing plate and the heat-conducting plate to increase the heat-conducting area and efficiency.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 14, 2013
    Inventors: Huei-Jan WU, Zu-Chao Hsu
  • Publication number: 20050067149
    Abstract: An improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins can assemble several fins for heat radiation of an electronic component. The improved heat-radiating fin set can be quickly mass-produced in an automatic way to lower the manufacturing and assembly cost without using any solder material for binding. The improved heat-radiating fin set comprises a heat pipe and several fins. A sleeve hole is disposed in each fin. A flange is formed at the edge of each of the sleeve holes. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 31, 2005
    Inventor: Huei-Jan Wu