Patents by Inventor Huei-Siang WONG

Huei-Siang WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210147219
    Abstract: A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Publication number: 20210111083
    Abstract: A sensing module, a semiconductor device package and a method of manufacturing the same are provided. The sensing module includes a sensing device, a first protection film and a second protection film. The sensing device has an active surface and a sensing region disposed adjacent to the active surface of the sensing device. The first protection film is disposed on the active surface of the sensing device and fully covers the sensing region. The second protection film is in contact with the first protection film and the active surface of the sensing device.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Publication number: 20210017018
    Abstract: A semiconductor package structure includes an electronic device having an exposed region adjacent to a first surface, a dam surrounding the exposed region of the semiconductor die and disposed on the first surface, the dam having a top surface away from the first surface, an encapsulant encapsulating the first surface of the electronic device, exposing the exposed region of the electronic device. A surface of the dam is retracted from a top surface of the encapsulant. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Patent number: 10818627
    Abstract: An electronic component includes a die, a first protective layer, a second protective layer, a first conductive pillar and a second conductive pillar. The die includes a conductive pad. The first protective layer is disposed on the die. The first protective layer defines a first opening to expose the conductive pad of the die. The second protective layer is disposed on the first protective layer. The second protective layer defines a second opening and a first recess. The second opening exposes the conductive pad of the die. The first conductive pillar is disposed within the second opening and electrically connected to the conductive pad. The second conductive pillar is disposed within the first recess. A height of the first conductive pillar is substantially equal to a height of the second conductive pillar. A bottom surface of the first recess is disposed between a top surface of the first protective layer and a top surface of the second protective layer.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: October 27, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Wei Liu, Huei-Siang Wong
  • Publication number: 20200303334
    Abstract: A semiconductor device and a semiconductor package including the same are provided. The semiconductor device includes a semiconductor element; a protective layer disposed adjacent to the surface of the semiconductor element, the protective layer defining an opening to expose the semiconductor element; a first bump disposed on the semiconductor element; and a second bump disposed onto the surface of the protective layer. The first bump has a larger cross-section surface area than the second bump.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG
  • Publication number: 20190067230
    Abstract: An electronic component includes a die, a first protective layer, a second protective layer, a first conductive pillar and a second conductive pillar. The die includes a conductive pad. The first protective layer is disposed on the die. The first protective layer defines a first opening to expose the conductive pad of the die. The second protective layer is disposed on the first protective layer. The second protective layer defines a second opening and a first recess. The second opening exposes the conductive pad of the die. The first conductive pillar is disposed within the second opening and electrically connected to the conductive pad. The second conductive pillar is disposed within the first recess. A height of the first conductive pillar is substantially equal to a height of the second conductive pillar. A bottom surface of the first recess is disposed between a top surface of the first protective layer and a top surface of the second protective layer.
    Type: Application
    Filed: August 29, 2017
    Publication date: February 28, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG