Abstract: A high-brightness light-emitting diode is disclosed. The high-brightness light-emitting diode, comprises: a chip; a base for holding the chip; and a transparent layer for covering the chip, wherein the chip is connected to an electrode by a metal wire. The improvement comprises an adhesive injection hole formed on the transparent layer for injecting a layer of fluorescent-powdered adhesive into it, thereby providing the light-emitting diode with the advantages such as good light collection and uniform light shape.

Abstract: A high-brightness light-emitting diode is disclosed. The high-brightness light-emitting diode, comprises: a chip; a base for holding the chip; and a transparent layer for covering the chip, wherein the chip is connected to an electrode by a metal wire. The improvement comprises an adhesive injection hole formed on the transparent layer for injecting a layer of fluorescent-powdered adhesive into it, thereby providing the light-emitting diode with the advantages such as good light collection and uniform light shape.

Abstract: A modular light emitting diode is disclosed. The modular light emitting diode comprises a heat-sinking base, a circuit board, a LED light emitting device, and a waterproofing layer. A protrudent portion and a plurality of trenches are formed on the surface of the heat-sinking base. Waterproof connection terminals are mounted on both sides of the circuit board. The LED light emitting device is mounted on and connected to the circuit board so as to form a complete circuit. Thereafter, the circuit board on which the LED light emitting device is mounted is stacked on the heat-sinking base to allow the LED light emitting device to be mounted on the protrudent portion of the heat-sinking base. These three stacked components are locally packaged by a waterproofing layer to complete the modular light emitting diode having the advantages of good waterproofing, rapid heat sinking, and flexible assembly.