Patents by Inventor Hueng Jae Oh
Hueng Jae Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9142499Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.Type: GrantFiled: June 11, 2014Date of Patent: September 22, 2015Assignee: SAMSUNG ELECTRO-MACHANICS CO., LTD.Inventors: Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee, Jin Won Choi
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Publication number: 20140291851Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.Type: ApplicationFiled: June 11, 2014Publication date: October 2, 2014Inventors: Ki Taek LEE, Hueng Jae OH, Sung Won JEONG, Gi Sub LEE, Jin Won CHOI
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Patent number: 8785789Abstract: Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.Type: GrantFiled: February 22, 2012Date of Patent: July 22, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hueng Jae Oh, Boo Yang Jung, Dae Young Lee, Jin Won Choi
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Patent number: 8766450Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.Type: GrantFiled: August 5, 2010Date of Patent: July 1, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee, Jin Won Choi
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Publication number: 20140138821Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.Type: ApplicationFiled: January 27, 2014Publication date: May 22, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hueng Jae OH, Tae Joon CHUNG, Dong Gyu LEE, Seon Jae MUN, Jin Won CHOI
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Patent number: 8708215Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.Type: GrantFiled: May 14, 2013Date of Patent: April 29, 2014Assignee: Samsung Electro-Machanics Co., Ltd.Inventors: Hueng Jae Oh, Yon Ho You, Jin Won Choi
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Patent number: 8671564Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.Type: GrantFiled: September 4, 2009Date of Patent: March 18, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi
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Patent number: 8651356Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.Type: GrantFiled: November 13, 2012Date of Patent: February 18, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Noriaki Mukai, Hueng Jae Oh, Dae Young Lee, Jin Won Choi
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Publication number: 20130306709Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.Type: ApplicationFiled: May 14, 2013Publication date: November 21, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hueng Jae Oh, Yon Ho You, Jin Won Choi
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Patent number: 8486760Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.Type: GrantFiled: September 29, 2010Date of Patent: July 16, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun
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Publication number: 20130161085Abstract: Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.Type: ApplicationFiled: February 22, 2012Publication date: June 27, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hueng Jae Oh, Boo Yang Jung, Dae Young Lee, Jin Won Choi
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Publication number: 20110079926Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.Type: ApplicationFiled: September 29, 2010Publication date: April 7, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun
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Publication number: 20110068473Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.Type: ApplicationFiled: August 5, 2010Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Taek Lee, Hueng Jae OH, Sung Won Jeong, Gi Sub Lee, Jin Won Choi
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Patent number: 7893355Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.Type: GrantFiled: September 15, 2008Date of Patent: February 22, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hueng Jae Oh, Jin Won Choi
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Publication number: 20100314161Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.Type: ApplicationFiled: September 4, 2009Publication date: December 16, 2010Inventors: Hueng Jae OH, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi
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Publication number: 20100271792Abstract: An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.Type: ApplicationFiled: November 4, 2009Publication date: October 28, 2010Inventors: Jin-Won Choi, Soon-Jin Cho, Hueng-Jae Oh, Seung-Wan Kim, Seon-Jae Mun
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Publication number: 20100000761Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.Type: ApplicationFiled: September 15, 2008Publication date: January 7, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hueng Jae Oh, Jin Won Choi