Abstract: Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.

Abstract: An automated tracking and control system measures the lateral displacement of a moving belt, using non-contact sensing. The displacement signal is provided to an algorithm that adjusts the tilts of the belt pulleys and steers the belt laterally. Non-contact sensors include inductive proximity sensors, which respond to the metal belt but are immune to airborne slurry and other non-metallic debris in a hostile environment typical of wafer polishing. Other non-contact sensors include shielded optical sensors. Dual sensor configurations cancel response to non-lateral displacements. Instrumentation, such as tension sensors, cylinder pressure sensors, load transducers, and limit switches, provides input to the algorithm. Independent tension signals for each belt edge verify proper functioning of, e.g., pad conditioners. User-specified belt displacements, e.g.

Abstract: The deposition material on, or removal of material from, an article, such as on an exposed surface of an intermediate integrated circuit structure, is optically monitored. The processes that are so monitored include the formation of a dielectric layer on a semiconductor wafer, and the removal of material from such a layer by planarization, polishing, or etching, a process of chemical-mechanical-polishing (CMP) being given as an example. A resulting optical signal is detected and processed in real time to provide information of the progress of the material formation or removal and an indication when an end point has been reached. The optical signal being processed varies sinusoidally as a result of interference between light reflected from a surface being operated upon and light reflected from some other surface. A differential or integral of this signal is formed to provide additional peaks and valleys that are detected in order to obtain data points from the signal every one-quarter period.

Abstract: In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface.

Abstract: Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.