Patents by Inventor Hugh Denham

Hugh Denham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070104875
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 10, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070099330
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070096065
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070096063
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070096064
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20070096062
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Precursor compositions for the deposition of electrically conductive features
    Publication number: 20060043346
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.
    Type: Application
    Filed: August 12, 2005
    Publication date: March 2, 2006
    Inventors: Toivo Kodas, Mark Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron Stump, Allen Schult, Paolina Atanassova, Klaus Kunze
  • Precursor compositions for the deposition of electrically conductive features
    Patent number: 6951666
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: October 4, 2005
    Assignee: Cabot Corporation
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity copper precursor compositions and methods for the deposition of conductive electronic features
    Publication number: 20030180451
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.
    Type: Application
    Filed: October 4, 2002
    Publication date: September 25, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Precursor compositions and methods for the deposition of passive electrical components on a substrate
    Publication number: 20030175411
    Abstract: Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.
    Type: Application
    Filed: October 4, 2002
    Publication date: September 18, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Precursor compositions for the deposition of passive electronic features
    Publication number: 20030161959
    Abstract: Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
    Type: Application
    Filed: November 1, 2002
    Publication date: August 28, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Low viscosity precursor compositons and methods for the depositon of conductive electronic features
    Publication number: 20030148024
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
    Type: Application
    Filed: October 4, 2002
    Publication date: August 7, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Precursor compositions for the deposition of electrically conductive features
    Publication number: 20030124259
    Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.
    Type: Application
    Filed: October 4, 2002
    Publication date: July 3, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Methods and compositions for the formation of recessed electrical features on a substrate
    Publication number: 20030108664
    Abstract: Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.
    Type: Application
    Filed: October 4, 2002
    Publication date: June 12, 2003
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze