Abstract: The foregoing objects are achieved as is now described. A method and system for testing an integrated circuit are provided. A test substrate is provided which is manufactured by the same particular production technology for which the complex integrated circuit is designed. A pattern generator for generating test data and a result checker for comparing output data are embedded on the test substrate. Isolated portions of circuitry of the integrated circuit are selectively embedded onto the test substrate. The isolated portions of circuitry are subjected to testing by applying test data from the pattern generator to the isolated portions of circuitry. Errors in the isolated portions of circuitry are detected with the result checker by comparing data output from the isolated portions of circuitry with predetermined expected data, such that the integrated circuit is tested by susets, independently of testing the integrated circuit in its entirety.

Abstract: An integrated circuit chip has a first i/o set associated with a first edge of the chip and a second i/o set associated with a second edge of the chip. The first i/o set has a physical symmetry with respect to the second i/o set, to facilitate a number of the chips being interconnected in a ring to one another on a multi-chip module, with the chips symetrically disposed thereon. The chip has a bus interconnecting the first and second i/o sets for transmitting signals across the chip. The bus has regeneration circuitry for regenerating said signals traversing the chip.