Abstract: A Tape-Automated Bonding (TAB) Frame Adapter System for providing an interface to a device having a plurality of closely spaced leads is disclosed. The preferred embodiment of the invention comprises a dielectric rectilinear adapter ring or platform that includes upper and lower surfaces. Four sidebars enclose a central aperture. Each pair of sidebars terminates in a corner junction which protrudes away from the central aperture. The sidebars bear rows of conductors which register with high density leads on the periphery of a TAB frame and a printed circuit board. Each corner junction is designed to include a through-hole, which is surrounded by a metal insert, and an alignment pin. The adapter ring is a critical element of a novel TAB assembly comprising a TAB frame bearing a chip, an elastomer, a lid, and a PC board. A set of screws fit in a set of holes in a lid and in a PC board to hold the entire assembly in compression.