Abstract: The present invention is a truncated probe for a perpendicular recording write head. The truncated probe is formed in a resist using a pullback process. In the pullback process, a trench is formed in the resist. The resist is then heated to a required temperature for a predetermined duration of time. By controlling the temperature and time, the amount of pullback of the resist is controlled to form a specified angle for the truncated probe. Further, the present invention increases the efficiency of the write head by reducing the distance between the air-bearing surface (ABS) and a magnetic back gap of the perpendicular recording write head yokes. This reduction reduces the length of the write head and permits a faster rise time of a recorded signal.

Abstract: The present invention is a side-by-side inductive head structure having a considerably reduced separation between the read and write elements of the head structure. The present invention also provides a thin film inductive head design to minimize rework during a fabrication process.

Abstract: The present invention is a truncated probe for a perpendicular recording write head. The truncated probe is formed in a resist using a pullback process. In the pullback process, a trench is formed in the resist. The resist is then heated to a required temperature for a predetermined duration of time. By controlling the temperature and time, the amount of pullback of the resist is controlled to form a specified angle for the truncated probe. Further, the present invention increases the efficiency of the write head by reducing the distance between the air-bearing surface (ABS) and a magnetic back gap of the perpendicular recording write head yokes. This reduction reduces the length of the write head and permits a faster rise time of a recorded signal.

Abstract: A thin film low profile write head is provided which has first and second pole pieces which are magnetically connected in a pole tip region and at a back gap. The pole tip region is located between the head surface and a zero throat height and the head has a body region which is located between the zero throat height and the back gap. A plurality of insulation layers are located above the first pole piece in the body region. Each of the insulation layers has an apex where the insulation layer commences and each insulation layer extends from its apex toward the back gap. The plurality of insulation layers typically includes first, second and third insulation layers. In the preferred embodiment the apex of the second insulation layer is located at and defines the zero throat height of the head. This enables a very narrow track width second pole tip to be constructed simultaneously with the second pole piece using ordinary photolithography processes.

Abstract: In the manufacture of a thin-film magnetic head having a vertical gap, auxiliary support is provided at the ends of a gap wall prior to formation of the magnetic poles. In a preferred embodiment, a pit is defined in a substrate and a release layer is deposited on the substrate followed by a layer of alumina. A recess is then etched through the alumina layer to the release layer in the pit. A partial layer of polymer or metal is deposited with a vertical edge across the median of the pit and recess. A layer of nonmagnetic wall material such as silicon oxide is deposited which after etching leaves a wall against the vertical edge of the partial layer. After removal of the partial layer, a vertical wall extends transversely across the recess and pit with the ends of the wall anchored and supported at the recess sidewalls. Alternatively, a pedestal may be provided in the recess to support each end of the wall. The magnetic poles are then formed simultaneously on either side of the wall.

Abstract: A method of constructing a narrow gap magnetoresistive (MR) read head is provided which prevents shorting between lead layers and shield layers. This is accomplished by a two-step process of depositing first gap layers before an MR sensor is deposited and a two-step process of depositing second gap layers after the MR sensor is formed. A very thin first gap layer is deposited on a first shield layer. A first MR region is then masked and a first gap pre-fill layer is deposited. The mask is lifted off leaving the first gap pre-fill layer everywhere except in the first MR region. An MR sensor and first and second leads are formed by various novel arrangements resulting in contiguous junctions or continuous spacer junctions therebetween. After completion of the MR sensor and leads, a very thin second gap layer is deposited. A second MR region, which encompasses the MR sensor, is masked and a second gap pre-fill layer is deposited.

Abstract: A method for fabricating a thin-film magnetic read/write head that eliminates contrast effects producing notching in a thin-film magnetic head coil caused by subsurface reflectivity at a reflective layer step during a photolithography step in the fabrication of the coil is provided. The method comprises the steps of forming a first permalloy yoke on a substrate, wherein the edges of the first yoke create steps from the top of the first yoke down to the substrate, forming a partial conformal layer of an electric insulation material over the first permalloy yoke and the substrate, forming a conformal copper seed layer over the electric insulation layer, forming a conductive coil on the electric insulation layer, wherein the copper coil is fabricated using a lithography process including placing a phase-shifting mask, formed in the image of the coil and containing non-printable openings covered by transparent material of a thickness that creates a 180.degree.

Abstract: A method for fabricating a thin-film magnetic read/write head that eliminates contrast effects producing notching in a thin-film magnetic head coil caused by subsurface reflectivity at a reflective layer step during a photolithography step in the fabrication of the coil is provided. The method comprises the steps of forming a first permalloy yoke on a substrate, wherein the edges of the first yoke create steps from the top of the first yoke down to the substrate, forming a partial conformal layer of an electric insulation material over the first permalloy yoke and the substrate, forming a conformal copper seed layer over the electric insulation layer, forming a conductive coil on the electric insulation layer, wherein the copper coil is fabricated using a lithography process including placing a phase-shifting mask, formed in the image of the coil and containing non-printable openings covered by transparent material of a thickness that creates a 180.degree.

Abstract: A holder for liquid phase epitaxial (LPE) growth which eliminates mesas on the surface of the film is described. The holder has two legs to which a ring is connected. The ring has holding means so that it can hold one wafer or two wafers back-to-back. One of the two legs extends vertically below the first ring. In a preferred embodiment a second ring having holding means for a pair of wafers back-to-back is attached to the elongated leg. This holder structure prevents a film from the liquid melt from forming when the holder is withdrawn from the liquid growth solution, thereby eliminating the formation of mesas which occur when the film ruptures.

Abstract: An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition.

Abstract: An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sensor projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sensor projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sensor associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sensor are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon.