Patents by Inventor Hugo Chang

Hugo Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6380839
    Abstract: A surface mount conductive polymer device includes a layer of conductive polymer material laminated between first and second metal foil electrodes. A thermal stress relief area is formed as an etched-out area in each of the electrodes. The etched-out areas are equal in surface area, and they are symmetrically disposed on the two electrodes, so that the two electrodes are themselves symmetrical, and are subject to equal degrees of thermal stress relief. First and second opposed end terminals are formed on the opposed ends of the laminated structure to providing electrical connection to the first and second electrodes, respectively.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: April 30, 2002
    Assignee: Bourns, Inc.
    Inventors: Lawrence Li, Daniel Grindell, Hugo Chang
  • Publication number: 20010015688
    Abstract: A surface mount conductive polymer device includes a layer of conductive polymer material laminated between first and second metal foil electrodes. A thermal stress relief area is formed as an etched-out area in each of the electrodes. The etched-out areas are equal in surface area, and they are symmetrically disposed on the two electrodes, so that the two electrodes are themselves symmetrical, and are subject to equal degrees of thermal stress relief. First and second opposed end terminals are formed on the opposed ends of the laminated structure to providing electrical connection to the first and second electrodes, respectively.
    Type: Application
    Filed: February 2, 2001
    Publication date: August 23, 2001
    Inventors: Lawrence Li, Daniel Grindell, Hugo Chang